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μModule Power Technology

μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.

 

Value and Benefits

µModule® (micromodule) regulators and DC-to-DC power products are complete system-in-package (SiP) power management solutions with integrated DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors within a compact, surface-mount BGA or LGA package. µModule power technology supports functions such as step-down (buck), step-down and step-up (buck-boost), battery charger, isolated converter, and LED driver.


By integrating the power function in a compact package, µModule regulator products address time and space constraints for markets that require complex power technology, ranging from industrial automation and instrumentation to aerospace and communications.

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Simplifies design and implementation

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Compact for space constrained applications

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Minimizes the need for external components

Highly integrated solutions that reduce design time and PCB space concerns

Easy Implementation with Minimal External Components

Complete system-in-package (SiP) power management integrates the DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors into one device to deliver a reliable, high-efficiency, and low EMI noise power solution.

Ultrathin Package for Space Constrained Applications

The package height of the ultrathin µModule Regulator product family is 1.82mm or 1.91mm (LGA). This thin package allows placement on the backside of the PCB or under a common heat sink with digital devices such as FPGAs, GPUs, ASICs, and processors. These parts are also offered in a BGA package (0.6mm taller than LGA).

Standard Packaging Simplifies Design Layout

µModule power products are provided in BGA and LGA packages. The pad assignment of the package is uniform for easy PCB design. Both RoHS compliant and SnPb terminal finishes are available in the BGA package.

uModule Chip

Vertical and Lateral Power Solutions for AI Systems, Data Centers

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