μModule Power Technology
μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.
Value and Benefits
µModule® (micromodule) regulators and DC-to-DC power products are complete system-in-package (SiP) power management solutions with integrated DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors within a compact, surface-mount BGA or LGA package. µModule power technology supports functions such as step-down (buck), step-down and step-up (buck-boost), battery charger, isolated converter, and LED driver.
By integrating the power function in a compact package, µModule regulator products address time and space constraints for markets that require complex power technology, ranging from industrial automation and instrumentation to aerospace and communications.
Simplifies design and implementation
Compact for space constrained applications
Minimizes the need for external components
Highly integrated solutions that reduce design time and PCB space concerns
Easy Implementation with Minimal External Components
Complete system-in-package (SiP) power management integrates the DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors into one device to deliver a reliable, high-efficiency, and low EMI noise power solution.
Ultrathin Package for Space Constrained Applications
The package height of the ultrathin µModule Regulator product family is 1.82mm or 1.91mm (LGA). This thin package allows placement on the backside of the PCB or under a common heat sink with digital devices such as FPGAs, GPUs, ASICs, and processors. These parts are also offered in a BGA package (0.6mm taller than LGA).
Standard Packaging Simplifies Design Layout
µModule power products are provided in BGA and LGA packages. The pad assignment of the package is uniform for easy PCB design. Both RoHS compliant and SnPb terminal finishes are available in the BGA package.
Vertical and Lateral Power Solutions for AI Systems, Data Centers
Application Interactive µModule Selection Tool
Sort options based on your application. Use this interactive infographic to easily identify the right µModule for your design.
Function Interactive µModule Selection Tool
Sort options based on component function. Use this interactive infographic to easily identify the right µModule for your design.
Package Interactive µModule Selection Tool
Sort options based on component package. Use this interactive infographic to easily identify the right µModule for your design.
Solution Resources
Hardware Products
Developer Tools and Resources
Simulation Models
Training and Support
Files and Downloads
µModule Power Products
9.87 M
AN119A - Powering Complex FPGA-Based Systems Using Highly Integrated DC/DC uModule Regulator Systems
499.00K
AN119B - Powering Complex FPGA-Based Systems Using Highly Integrated DC/DC uModule Regulator Systems
283.00K
uModule LGA and BGA Packaging Care and Assembly Instructions
466.00K
DN1021 - How to Produce Negative Output Voltages from Positive Inputs Using a uModule Step-Down Regulator
117.00K
DN430 - 8A Low Voltage, Low Profile DC/DC Module Regulator in 9mm x 15mm Package Weighs Only 1g
90.00K
AN103 - LTM4600 DC/DC uModule Thermal Performance
183.00K
AN110 - LTM4601 DC/DC uModule Thermal Performance
188.00K
DN438 - uModule Buck-Boost Regulators Offer a Simple and Efficient Solution for Wide Input and Output Voltage Range Applications
96.00K
DN411 - Simple and Compact 4-Output Point-of-Load DC/DC uModule System
688.00K
DN385 - 10A High Performance Point-of-Load DC/DC uModule
145.00K
Assembly Considerations for µModule® BGA and LGA Packages
3.06 M
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