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REF43S
PRODUCTIONAerospace +2.5V Low-Power Precision Voltage Reference
- Part Models
- 10
- 1ku List Price
- Starting From $144.93
Part Details
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The REF43 is a low-power precision reference providing a stable +2.5V output independent of variations in supply voltage, load conditions or ambient temperature. It is suitable as a reference level for 8, 10 and 12-bit data acquisition systems, or wherever a stable, known voltage is required.
Tight output tolerances and low thermal drift are assured by zener-zap trimming of both output voltage and its temperature coefficient. A unique curvature correction circuit reduces the thermal curvature, which is characteristic of many previous bandgap references.
Documentation
Data Sheet 2
Low Dose Rate Radiation Reports 1
Radiation Report 1
High Dose Rate Radiation Reports 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962L9060304VHA | CERPAK(HERM CER SRF MOUNT) | ||
| 5962R9060302VPA | CERDIP GLASS SEAL | ||
| 5962R9060303VHA | CERPAK(HERM CER SRF MOUNT) | ||
| REF430803J | ROUND HEADER/METAL CAN | ||
| REF430803L | CERPAK(HERM CER SRF MOUNT) | ||
| REF430803RC | LCC:CER LEADLESS CHIP CARR | ||
| REF430803Z | CERDIP GLASS SEAL | ||
| REF43AL-EMX | CERPAK(HERM CER SRF MOUNT) | ||
| REF43R803J | ROUND HEADER/METAL CAN | ||
| REF43R803RC | LCC:CER LEADLESS CHIP CARR |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962L9060304VHA | PRODUCTION | |
| 5962R9060302VPA | PRODUCTION | |
| 5962R9060303VHA | PRODUCTION | |
| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Sep 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
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| REF430803J | PRODUCTION | |
| REF43R803J | PRODUCTION | |
|
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Sep 16, 2015 - 15_0179 REF43S Standard Space Level Products Fab Site Transfer and Change From 100 to 150 mm Wafer Diameter |
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| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| REF430803J | PRODUCTION | |
| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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| REF430803J | PRODUCTION | |
| REF430803RC | PRODUCTION | |
|
Oct 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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| REF430803L | PRODUCTION | |
| REF430803RC | PRODUCTION | |
| REF430803Z | PRODUCTION | |
| REF43R803J | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| REF430803L | PRODUCTION | |
| REF430803Z | PRODUCTION | |
|
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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| REF430803L | PRODUCTION | |
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Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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| REF430803L | PRODUCTION | |
| REF430803Z | PRODUCTION | |
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Apr 21, 2016 - 16_0066 REF43S Limit Change for Standard Space Models in LCC Package |
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| REF430803RC | PRODUCTION | |
| REF43R803RC | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.