OP467
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OP467

Quad Precision, High Speed Operational Amplifier

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 8
1ku List Price Starting From $13.09
Features
  • High slew rate: 170 V/μs
  • Wide bandwidth: 28 MHz
  • Fast settling time: <200 ns to 0.01%
  • Low offset voltage: <500 μV
  • Unity-gain stable
  • Low voltage operation: ±5 V to ±15 V
  • Low supply current: <10 mA
  • Drives capacitive loads
Additional Details
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The OP467 is a quad, high speed, precision operational amplifier. It offers the performance of a high speed op amp combined with the advantages of a precision op amp in a single package. The OP467 is an ideal choice for applications where, traditionally, more than one op amp was used to achieve this level of speed and precision.

The internal compensation of the OP467 ensures stable unity-gain operation, and it can drive large capacitive loads without oscillation. With a gain bandwidth product of 28 MHz driving a 30 pF load, output slew rate is 170 V/μs, and settling time to 0.01% in less than 200 ns, the OP467 provides excellent dynamic accuracy in high speed data acquisition systems. The channel-to-channel separation is typically 60 dB at 10 MHz.

The dc performance of the OP467 includes less than 0.5 mV of offset, a voltage noise density below 6 nV/√Hz, and a total supply current under 10 mA. The common-mode rejection ratio (CMRR) is typically 85 dB. The power supply rejection ratio (PSRR) is typically 107 dB. PSRR is maintained to better than 40 dB with input frequencies as high as 1 MHz. The low offset and drift plus high speed and low noise make the OP467 usable in applications such as high speed detectors and instrumentation.

The OP467 is specified for operation from ±5 V to ±15 V over the extended industrial temperature range (−40°C to +85°C) and is available in a 14-lead PDIP, a 14-lead CERDIP, a 16-lead SOIC, and a 20-terminal LCC.

Contact your local sales office for the MIL-STD-883 data sheet and availability.

Applications

  • High speed image display drivers
  • High frequency active filters
  • Fast instrumentation amplifiers
  • High speed detectors
  • Integrators
  • Photo diode preamps
Part Models 8
1ku List Price Starting From $13.09

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-9325801M2A
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5962-9325801MCA
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OP467ARC/883C
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OP467AY/883C
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OP467GBC
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OP467GPZ
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OP467GSZ
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OP467GSZ-REEL
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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Jul 31, 2009

- 09_0106

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Sep 9, 2009

- 07_0083

Polyimide Change

OP467GBC

PRODUCTION

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Mar 29, 2021

- 21_0033

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Feb 7, 2011

- 10_0003

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Jul 31, 2009

- 09_0106

arrow down

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

5962-9325801M2A

PRODUCTION

5962-9325801MCA

PRODUCTION

OP467ARC/883C

PRODUCTION

OP467AY/883C

PRODUCTION

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Sep 9, 2009

- 07_0083

arrow down

Polyimide Change

OP467GBC

PRODUCTION

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Mar 29, 2021

- 21_0033

arrow down

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

OP467GPZ

PRODUCTION

OP467GSZ

PRODUCTION

OP467GSZ-REEL

PRODUCTION

Feb 7, 2011

- 10_0003

arrow down

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

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Software & Part Ecosystem

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