OP37S

PRODUCTION

OP37S

Aerospace Low Noise Precision High Speed Op Amp

PRODUCTION

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Features

Low Noise
Low Drift: 0.2 µV/°C typical
High Speed: 17 V/µs Slew Rate 63 MHz Gain Bandwidth

Low Input Offset Voltage: 10 µV typical
Excellent CMRR: 126 dB
(Common-Voltage @ 11 V)
High Open-Loop Gain: 1.8 Million

Additional Details

The OP37 provides the same high performance as the OP-27, but the design is optimized for circuits with gains greater than five. This design change increases slew rate to 17V/µsec and gain-bandwidth product to 63MHz.

The OP37 provides the low offset and drift of the OP07 plus higher speed and lower noise. Offsets down to 25µV and drift of 0.6µV/°C maximum make the OP37 ideal for precision instrumentation applications. Exceptionally low noise, a low 1/f noise corner frequency , and the high gain of 1.8 million, allow accurate high-gain amplification of low-level signals.

The low input bias current of ±10nA and offset current of 7nA are achieved by using a bias-current-cancellation circuit.

The output stage has good load driving capability. A guaranteed swing of ±10V into 600 Ohm and low output distortion make the OP37 an excellent choice for audio applications.

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Ask a Question

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Support

Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

Visit the ADI Support Page

Ask the ADI community for help.

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FAQs

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Part Models 3

1ku List Price

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Technical Documents 1

OP37S: Military Data Sheet 05/13/2008

Design Resources 3

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-8853701VGA	20 ld LCC	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
5962-8853701VPA	8-Lead CerDIP	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
OP37-207C	CHIPS OR DIE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys

5962-8853701VGA
Pin/Package Drawing
20 ld LCC
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

5962-8853701VPA
Pin/Package Drawing
8-Lead CerDIP
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

OP37-207C
Pin/Package Drawing
CHIPS OR DIE
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

PCN/PDN Information

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Product Lifecycle

PCN

Sep 29, 2022

- 22_0195

Shipment Carrier Change for TO-99 Header Package

5962-8853701VGA

pdf

PCN22_0195_Form

xls

Material_Report

pdf

Qualification Results Summary

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8853701VGA

5962-8853701VPA

pdf

PCN16_0026_Form

xls

Material_Report

Qualification Results Summary

Oct 29, 2017

- 17_0079

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

5962-8853701VGA

5962-8853701VPA

pdf

PCN17_0079_Form

xls

Material_Report

pdf

Test Correlation Report

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-8853701VGA

5962-8853701VPA

pdf

PCN15_0219_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8853701VGA

5962-8853701VPA

pdf

PCN13_0163_Form

xls

Material_Report

pdf

Qualification Plan Summary

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8853701VGA

5962-8853701VPA

pdf

PCN11_0050_Form

xls

Material_Report

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8853701VGA

5962-8853701VPA

pdf

PCN11_0182_Form

xls

Material_Report

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8853701VPA

pdf

PCN12_0199_Form

xls

Material_Report

pdf

Qualification Report Summary

pdf

Datasheet Specification Comparison

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

5962-8853701VPA

pdf

08_0073AQualPlan

xls

Material_Report

pdf

PCN08_0073_Form

Filter by Model

Part Models

Product Lifecycle

PCN

Sep 29, 2022

- 22_0195

Shipment Carrier Change for TO-99 Header Package

5962-8853701VGA

pdf

PCN22_0195_Form

xls

Material_Report

pdf

Qualification Results Summary

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8853701VGA

5962-8853701VPA

pdf

PCN16_0026_Form

xls

Material_Report

Qualification Results Summary

Oct 29, 2017

- 17_0079

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

5962-8853701VGA

5962-8853701VPA

pdf

PCN17_0079_Form

xls

Material_Report

pdf

Test Correlation Report

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-8853701VGA

5962-8853701VPA

pdf

PCN15_0219_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8853701VGA

5962-8853701VPA

pdf

PCN13_0163_Form

xls

Material_Report

pdf

Qualification Plan Summary

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8853701VGA

5962-8853701VPA

pdf

PCN11_0050_Form

xls

Material_Report

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8853701VGA

5962-8853701VPA

pdf

PCN11_0182_Form

xls

Material_Report

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8853701VPA

pdf

PCN12_0199_Form

xls

Material_Report

pdf

Qualification Report Summary

pdf

Datasheet Specification Comparison

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

5962-8853701VPA

pdf

08_0073AQualPlan

xls

Material_Report

pdf

PCN08_0073_Form

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