MAX2676
PRODUCTIONGPS/GNSS LNAs with Antenna Switch and Bias
Low-Noise-Figure GPS LNAs in an Ultra-Small WLP Package with Autosensing Bypass Switch
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- Eliminates Discrete Antenna Sensing, Switching, and Bias Networks
- Autodetects Antenna Connection
- Provides Antenna Bias
- Short-Circuit Protection
- Wide 1.6V to 3.6V Supply Voltage Range
- Ultra-Small Footprint (0.86mm x 1.26mm) WLP Package
- For Applications Without Antenna Port, Use Pin-Compatible 4-Bump MAX2686/MAX2687/MAX2688 LNA
The MAX2674/MAX2676 are ultra-small, high-IP3, low-noise amplifiers (LNAs) designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim's advanced SiGe process, the devices are also equipped with an autosensing feature for applications that enable the use of external antennas. These high-performance LNAs provide high gain and an ultra-low noise figure while optimizing the input-referred 2dB compression point and 3rd-order intercept point.
The ultra-small size is ideal for front-end modules and receiver applications in cellular phones, smartphones, PDAs, PNDs, or other custom GNSS applications. The MAX2674/MAX2676 operate from a 1.6V to 3.6V single supply. The MAX2674 is optimized for high gain, while the MAX2676 is optimized for high linearity. A shutdown feature is present in both devices reducing the supply current to less than 10µA. The antenna port automatically senses when an external antenna is connected, eliminating the need for additional control circuitry while also providing improved short-circuit protection. The MAX2674/MAX2676 are available in an ultra-small, RoHS-compliant 0.86mm x 1.26mm x 0.64mm wafer-level package (WLP).
Applications
- Cellular and Smartphones
- Front-End SAW Modules
- Personal Navigation Devices (PNDs)
- Receiver Modules
- Recreational, Marine Navigation
- Telematics (Asset Tracking and Management)
Documentation
Data Sheet 1
Technical Articles 1
Evaluation Design File 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
MAX2676EWT+ | Wafer-Level Package 3x2 Bump, Full Array | ||
MAX2676EWT+T | Wafer-Level Package 3x2 Bump, Full Array |
Part Models | Product Lifecycle | PCN |
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No Match Found | ||
Aug 14, 2023 - 2275A WAFER FAB |
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MAX2676EWT+ | PRODUCTION | |
MAX2676EWT+T | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.