MAX2667
PRODUCTIONGPS/GNSS Ultra-Low-Noise-Figure LNAs
Industry's Lowest Noise Figure GPS LNAs Deliver High Gain and High Linearity in a Tiny Package
- Part Models
- 2
- 1ku List Price
- Starting From $0.76
Part Details
- 19dB High-Power Gain (MAX2667)
- Ultra-Low Noise Figure: 0.65dB
- Integrated 50Ω Output Matching Circuit
- Low 4.1mA Supply Current (MAX2667)
- Wide 1.6V to 3.3V Supply Voltage Range
- Low Bill of Materials: Two Inductors, Three Capacitors, and One Resistor
- Small Footprint: 0.86mm x 1.26mm
- Thin Profile: 0.65mm
- 0.4mm-Pitch Wafer-Level Package (WLP)
The MAX2667/MAX2669 high-gain, low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim’s advanced SiGe process, the devices achieve a high gain and our lowest noise figure, while maximizing the input-referred 1dB compression point and the 3rd-order intercept point.
The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for low current. The MAX2669 is optimized for high linearity. The shutdown feature in the device reduces the supply current to be less than 10µA. The devices are available in a very small, lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm wafer-level package (WLP).
Applications
- Automotive Navigation
- Avionics
- Cellular Phones with GPS
- Location-Enabled Mobile Devices
- Notebook PCs/Ultra-Mobile PCs
- Personal Navigation Devices (PNDs)
- Recreational, Marine Navigation
- Telematics (Asset Tracking and Management)
- Watches
Documentation
Data Sheet 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
MAX2667EWT+ | Wafer-Level Package 3x2 Bump, Full Array | ||
MAX2667EWT+T | Wafer-Level Package 3x2 Bump, Full Array |
Part Models | Product Lifecycle | PCN |
---|---|---|
Aug 14, 2023 - 2275A WAFER FAB |
||
MAX2667EWT+ | PRODUCTION | |
MAX2667EWT+T | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Latest Discussions
No discussions on max2667 yet. Have something to say?
Start a Discussion on EngineerZone®