HMC966

RECOMMENDED FOR NEW DESIGNS

HMC966

I/Q Downconverter SMT, 17 - 20 GHz

RECOMMENDED FOR NEW DESIGNS

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Features

Conversion Gain: 14 dB
Image Rejection: 40 dBc
2 LO to RF Isolation: 40 dB
Noise Figure: 2.5 dB
Input IP3: 0 dBm
24 Lead 4x4mm QFN Package: 16mm²

Additional Details

The HMC966LP4E is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SM T package. This device provides a small signal conversion gain of 12 dB with a noise figure of 2.5 dB and 40 dBc of image rejection across the frequency band. The HMC966LP4E utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC966LP4E is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and is compatible with surface mount manufacturing techniques.

Applications

Point-to-Point & Point-to-Multi-Point Radio
Military Radar, EW & ELINT
Satellite Communications

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Ask a Question

Submit your question below and we will return the best answer from ADI’s knowledge database:

Other places you can find help

Support

Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

Visit the ADI Support Page

Ask the ADI community for help.

Ask the EngineerZone Community

FAQs

Sales & Ordering FAQs

Part Models 2

1ku List Price

price unavailable

Technical Documents 1

HMC966 GaAs MMIC I/Q Downconverter 17 - 20 GHz Data Sheet 08/31/2017

Reference Materials 5

4 x 4 mm QFN Tape Specification (LP4, LP4B, LP4C, LC4, LC4B) 10/28/2015

RF, Microwave, and Millimeter Wave Product Selection Guide 07/13/2018

Package/Assembly Qualification Test Report: LP4, LP4B, LP4C, LP4K (QTR: 2013-00487 REV: 04) 10/29/2015

Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR: 05006 REV: 02) 01/01/0001

Semiconductor Qualification Test Report: PHEMT-A (QTR: 2013-00267) 04/22/2015

Design Resources 2

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC966LP4E	24-Lead QFN (4mm x 4mm w/ EP)	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC966LP4ETR	24-Lead QFN (4mm x 4mm w/ EP)	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys

HMC966LP4E
Pin/Package Drawing
24-Lead QFN (4mm x 4mm w/ EP)
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

HMC966LP4ETR
Pin/Package Drawing
24-Lead QFN (4mm x 4mm w/ EP)
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

PCN/PDN Information

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Part Models

Product Lifecycle

PCN

Mar 29, 2023

- 22_0048

Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

HMC966LP4E

PRODUCTION

HMC966LP4ETR

PRODUCTION

pdf

PCN22_0048_Form

xls

Material_Report

pdf

Qualification Results Summary

pdf

Detailed Change Description

Filter by Model

Part Models

Product Lifecycle

PCN

Mar 29, 2023

- 22_0048

Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

HMC966LP4E

PRODUCTION

HMC966LP4ETR

PRODUCTION

pdf

PCN22_0048_Form

xls

Material_Report

pdf

Qualification Results Summary

pdf

Detailed Change Description

S-Parameter 1

Simulation Model

S-Parameter

HMC966 S-Parameter

6.96 KB

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