HMC8118

RECOMMENDED FOR NEW DESIGNS

71 GHz to 76 GHz, E-Band I/Q Upconverter

Data Sheet (Rev. A) Product Selection Table

Part Models: 2
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Overview

Conversion loss: 11 dB typical
Sideband rejection: 33 dBc typical Input power for 1 dB compression (P1dB): 14 dBm typical
Input third-order intercept (IP3): 22 dBm typical
Input second-order intercept (IP2): −5 dBm typical
6× local oscillator (LO) leakage at RFOUT: −27 dBm typical
RF return loss: 6 dB typical
LO return loss: 18 dB typical
Die size: 3.601 mm × 1.609 mm × 0.05 mm

The HMC8118 is an integrated E-band gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) in-phase/ quadrature (I/Q) upconverter chip that operates from 71 GHz to 76 GHz. The HMC8118 provides a small signal conversion loss of 11 dB with 33 dBc of sideband rejection across the frequency band. The device uses an image rejection mixer that is driven by a 6× LO multiplier. Differential I and Q mixer inputs are provided. The inputs can be driven with differential I and Q baseband waveforms for direct conversion applications. Alternatively, the inputs can be driven using an external 90° hybrid and two external 180° hybrids for single sideband applications. All data includes the effect of a 1 mil gold wire wedge bond on the intermediate frequency (IF) port.

Applications

E-band communication systems
High capacity wireless backhaul
Test and measurement

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC8118: 71 GHz to 76 GHz, E-Band I/Q Upconverter Data Sheet (Rev.A) 02/25/2016

Technical Articles 1

E-Band Wireless Radio Links Deliver High Capacity Backhaul Solutions for 5G Networks—Part 1 10/23/2023

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC8118	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC8118-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

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