HMC8073
Info : RECOMMENDED FOR NEW DESIGNS
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HMC8073

0.6 GHz to 3.0 GHz, 0.5 dB LSB, 6-Bit, Silicon Digital Step Attenuator

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 2
1ku List Price
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Features
  • Attenuation range: 0.5 dB LSB steps to 31.5 dB
  • Low insertion loss 
    • 1.1 dB to 1.0 GHz
    • 1.5 dB to 2.0 GHz
  • Tight attenuation accuracy
    • Less than ±0.25 dB (plus 3% of attenuation state)
  • Low phase shift error: 4° phase shift to 1.0 GHz
  • Bidirectional use: 30 dBm high power handling 
  • Internal dc block on the RFIN/RFOUT pins 
  • High linearity 
    • P1dB: 31 dBm typical 
    • Input IP3: 52 dBm typical
  • Safe state transitions
  • Serial interface with TTL/CMOS
    • Up to 8 devices on a single data bus
  • Single-supply operation: 3.3 V to 5.0 V  
  • ESD sensitivity rating: Class 1C (1 kV human body model) 
  • 16-lead, 3 mm × 3 mm LFCSP package: 9 mm2
Additional Details
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The HMC8073 is a 6-bit digital step attenuator (DSA), operating from 0.6 GHz to 3.0 GHz, that features 31.5 dB of attenuation range with 0.5 dB steps.

The HMC8073 is implemented in a silicon process, offering a fast settling time, low power consumption, and high electrostatic discharge (ESD) robustness. The device features safe state transitions, allowing attenuation state changes without overshooting, and is optimized for excellent step accuracy and high power and high linearity over frequency and temperature range. The radio frequency (RF) input and output are internally matched to 50 Ω and do not require any external matching components. The design is bidirectional, and the RF input and output are interchangeable.

The external address feature of the HMC8073 allows users to control up to eight DSAs using a single bus. The DSA has an on-chip regulator that supports a wide supply operating range from 3.3 V to 5.0 V with no performance change in electrical characteristics. The HMC8073 incorporates a complementary metal-oxide semiconductor (CMOS)- and transistor transitory logic (TTL)- compatible interface that supports serial (3-wire) control of the attenuator.

The HMC8073 comes in an RoHS compliant, compact, 3 mm × 3 mm LFCSP package.

Applications

  • Cellular infrastructure
  • Microwave radios 
  • Very small aperture terminals
  • Test equipment and sensors
Part Models 2
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
HMC8073LP3DE
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HMC8073LP3DETR
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Product Lifecycle

PCN

Apr 19, 2022

- 22_0048

Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

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Part Models

Product Lifecycle

PCN

Apr 19, 2022

- 22_0048

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Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

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EVAL-HMC8073

HMC8073 Evaluation Board

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EVAL-HMC8073

HMC8073 Evaluation Board

HMC8073 Evaluation Board

Product Detail

The HMC8073 evaluation board is constructed of a 4 layer material with a copper thickness of 0.7 mil on each layer. Every copper layer is separated with a dielectric material. The top dielectric material is 10 mil RO4350. The middle and bottom dielectric materials are FR-4, used for mechanical strength and overall board thickness of approximately 62 mil, which allows SMA connectors to be slipped in at the board edges.

Resources

Tools & Simulations

Tools & Simulations 3

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