Features and Benefits
- Attenuation range: 0.5 dB LSB steps to 31.5 dB
- Low insertion loss
- 1.1 dB to 1.0 GHz
- 1.5 dB to 2.0 GHz
- Tight attenuation accuracy
- Less than ±0.25 dB (plus 3% of attenuation state)
- Low phase shift error: 4° phase shift to 1.0 GHz
- Bidirectional use: 30 dBm high power handling
- Internal dc block on the RFIN/RFOUT pins
- P1dB: 31 dBm typical
- Input IP3: 52 dBm typical
- Safe state transitions
- Serial interface with TTL/CMOS
- Up to 8 devices on a single data bus
- Single-supply operation: 3.3 V to 5.0 V
- ESD sensitivity rating: Class 1C (1 kV human body model)
- 16-lead, 3 mm × 3 mm LFCSP package: 9 mm2
The HMC8073 is a 6-bit digital step attenuator (DSA), operating from 0.6 GHz to 3.0 GHz, that features 31.5 dB of attenuation range with 0.5 dB steps.
The HMC8073 is implemented in a silicon process, offering a fast settling time, low power consumption, and high electrostatic discharge (ESD) robustness. The device features safe state transitions, allowing attenuation state changes without overshooting, and is optimized for excellent step accuracy and high power and high linearity over frequency and temperature range. The radio frequency (RF) input and output are internally matched to 50 Ω and do not require any external matching components. The design is bidirectional, and the RF input and output are interchangeable.
The external address feature of the HMC8073 allows users to control up to eight DSAs using a single bus. The DSA has an on-chip regulator that supports a wide supply operating range from 3.3 V to 5.0 V with no performance change in electrical characteristics. The HMC8073 incorporates a complementary metal-oxide semiconductor (CMOS)- and transistor transitory logic (TTL)- compatible interface that supports serial (3-wire) control of the attenuator.
The HMC8073 comes in an RoHS compliant, compact, 3 mm × 3 mm LFCSP package.
- Cellular infrastructure
- Microwave radios
- Very small aperture terminals
- Test equipment and sensors
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The HMC8073 evaluation board is constructed of a 4 layer material with a copper thickness of 0.7 mil on each layer. Every copper layer is separated with a dielectric material. The top dielectric material is 10 mil RO4350. The middle and bottom dielectric materials are FR-4, used for mechanical strength and overall board thickness of approximately 62 mil, which allows SMA connectors to be slipped in at the board edges.
Tools & Simulations
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
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