Overview

Product Details

The HMC8073 evaluation board is constructed of a 4 layer material with a copper thickness of 0.7 mil on each layer. Every copper layer is separated with a dielectric material. The top dielectric material is 10 mil RO4350. The middle and bottom dielectric materials are FR-4, used for mechanical strength and overall board thickness of approximately 62 mil, which allows SMA connectors to be slipped in at the board edges.

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Documentation & Resources

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  • Evaluation Design File (1)
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