Overview
Features and Benefits
- Frequency band: 57 GHz to 64 GHz
- RF signal bandwidth: up to 1.8 GHz
- Output power for 1 dB compression: 15 dBm
- Gain: 5 dB to 35 dB
- Digital and analog RF and IF gain control
- Integrated frequency synthesizer
- Integrated image reject filter
- Partially external loop filter
- Support for external local oscillator (LO)
- On-chip temperature sensor
- Support for 256 QAM modulation
- Integrated minimum shift keying (MSK) modulator
- Universal analog I/Q baseband interface
- 3-wire serial digital interface
- 65-ball, RoHS compliant, wafer level ball grid array
Product Details
The HMC6300 is a complete millimeterwave transmitter integrated circuit in a 6 mm × 4 mm RoHS compliant wafer level ball grid array (WLBGA) that operates from 57 GHz to 64 GHz with up to 1.8 GHz modulation bandwidth.
An integrated synthesizer provides tuning in 250 MHz, 500 MHz, or 540 MHz steps with excellent phase noise to support up to 64 QAM modulation. Optionally, an external LO can be injected allowing for user selectable LO characteristics or phase coherent transmit and receive operation, as well as modulation up to 256 QAM. Support for a wide variety of modulation formats is provided through a universal analog baseband I/Q interface. The transmitter chip optionally supports dedicated frequency-shift keying (FSK), minimum shift keying (MSK), and on-off keying (OOK) modulation formats for lower cost and lower power serial data links without the need for high speed data converters.
A differential output provides up to 15 dBm linear output power into a 100 Ω load. Single-ended operation is also supported up to 12 dBm. Together with the HMC6301, a complete 60 GHz transceiver chipset is provided for multiple Gbps operation in the unlicensed 60 GHz ISM band.
Applications
- Small cell backhaul
- 60 GHz industrial, scientific, and medical (ISM) band data transfer
- Multiple Gbps data communication
- WiGig/802.11ad radio
- High definition video transmission
- Radar/high resolution imaging
Product Categories
Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
Product Recommendations
HMC6300 Companion Parts
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC6300BG46 | Material Declaration | Reliability Data | 65-Ball WLBGA | |
| Wafer Fabrication Data |
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Evaluation Boards
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.