HMC609-Die
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HMC609-Die

Low Noise Amplifier Chip, 2 - 4 GHz

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S-Parameter HMC609-Die S-Parameters Download 16.36 KB
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Features
  • Gain Flatness: 0.2 dB
  • Output IP3: +36 dBm
  • Gain: 20.5 dB
  • Output P1dB: +22 dBm
  • 50 Ohm Matched Input/Output
  • Die Size: 2.11 x 1.32 x 0.10 mm
Additional Details
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The HMC609 is a GaAs PHEMT MMIC Low Noise Amplifier (LNA) chip which operates from 2 to 4 GHz. The HMC609 features extremely flat performance characteristics including 20dB of small signal gain, 3dB of noise figure and output IP3 of +36 dBm across the operating band. The versatile LNA is ideal for hybrid and MCM assemblies due to its compact size, consistent output power and DC blocked RF I/O's. All data is measured with the chip in a 50 Ohm test fixture connected via one 0.025 mm (1 mil) diameter bondwire of minimal length 0.31 mm (12 mil).


Applications

  • Fixed Microwave
  • Point-to-Multi-Point Radios 
  • Test & Measurement Equipment
  • Radar & Sensors
  • Military & Space
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file View Data Sheet
Documentation View All Documentation
S-Parameter HMC609-Die S-Parameters Download 16.36 KB
Part Models 2
1ku List Price
price unavailable
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HMC609-Die

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Data Sheet

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UPDATED 04/15/2015
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HMC609 Die Datasheet

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Application Note

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UPDATED 11/11/2015
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Thermal Management for Surface Mount Components General Application Note redirect icon

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UPDATED 05/13/2020
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AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers redirect icon

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UPDATED 05/13/2020
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利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 redirect icon

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UPDATED 08/01/2019
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AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages redirect icon

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UPDATED 08/01/2019
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AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages redirect icon

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UPDATED 08/01/2019
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AN-1604: LFCSP パッケージおよびフランジ・パッケージに収容された RF アンプの温度管理計算 redirect icon

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Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
HMC609 CHIPS OR DIE
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  • Material Declaration external-link
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HMC609-SX CHIPS OR DIE
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  • Material Declaration external-link
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