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HMC594 Die Data Sheet4/16/2015
Overview
Features and Benefits
- Gain Flatness: 0.2 dB
- Output IP3: +36 dBm
- Gain: 10 dB
- DC Supply: +6V @ 100mA
- 50 Ohm Matched Input/Output
- Die Size: 1.32 x 1.21 x 0.10 mm
Product Details
The HMC594 is a GaAs PHEMT MMIC Low Noise Amplifier (LNA) chip which operates from 2 to 4 GHz. The HMC594 features extremely flat performance characteristics including 10dB of small signal gain, 2.6dB of noise figure and output IP3 of +36 dBm across the operating band. This versatile LNA is ideal for hybrid and MCM assemblies due to its Compact size, consistent output power and DC block RF I/O's. All data is measured with the chip in a 50 Ohm test fixture connected via one 0.025 mm (1 mil) diameter bondwire of minimal length 0.31 mm (12 mil).
- Fixed Microwave
- Point-to-Multi-Point Radios
- Test & Measurement Equipment
- Radar & Sensors
- Military & Space
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Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
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Sys-Parameters
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
S-Parameters
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ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
---|---|---|---|---|
HMC594 | Material Declaration | Reliability Data | CHIPS OR DIE | |
HMC594-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
Wafer Fabrication Data |
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