HMC464 Die Data Sheet10/19/2015612 K
Features and Benefits
- P1dB Output Power: +26 dBm
- Gain: 16 dB
- Output IP3: +30 dBm
- Supply Voltage: +8V @ 290 mA
- 50 Ohm Matched Input/Output
- Die Size: 3.12 x 1.63 x 0.1 mm
The HMC464 is a GaAs MMIC PHEMT Distributed Power Amplifier die which operates between 2 and 20 GHz. The amplifier provides 16 dB of gain, +30 dBm Output IP3 and +26 dBm of output power at 1 dB gain compression while requiring 290 mA from a +8V supply. Gain flatness is excellent from 2 - 18 GHz making the HMC464 ideal for EW, ECM and radar driver amplifier applications. The HMC464 amplifier I/O’s are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).
- Telecom Infrastructure
- Microwave Radio & VSAT
- Military & Space
- Test Instrumentation
- Fiber Optics
Markets and Technologies
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
AN-2061: Wideband Bias Tee Design Using 0402, SMD Components11/30/2020
AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers5/13/2020
Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages (Rev. 0)8/9/2019247 K
Thermal Management for Surface Mount Components General Application Note11/11/2015189 K
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
Semiconductor Qualification Test Report: PHEMT-F (QTR: 2013-00269)10/29/2015824 K
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC464||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC464-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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