Features and Benefits
- Noise Figure: 2.5 dB @ 10 GHz
- Gain: 14 dB @ 10 GHz
- P1dB Output Power: +16 dBm @ 10 GHz
- Supply Voltage: +8V @ 60 mA
- 50 Ohm Matched Input/Output
- Die Size: 3.12 × 1.63 × 0.1 mm
The HMC460 is a GaAs MMIC PHEMT Low Noise Distributed Amplifier die which operates between DC and 20 GHz. The amplifier provides 14 dB of gain, 2.5 dB noise figure and +16 dBm of output power at 1 dB gain compression while requiring only 60 mA from a +8V supply. The HMC460 amplifier can easily be integrated into Multi-Chip-Modules (MCMs) due to its small size. All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).
- Telecom Infrastructure
- Microwave Radio & VSAT
- Military & Space
- Test Instrumentation
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC460||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC460-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
Sample & Buy
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Buy Now Pricing
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