HMC342 Die Data Sheet10/22/2015584K
Features and Benefits
- Noise Figure: 3.5 dB
- Gain: 20 dB
- Single Supply: +3V @ 36 mA
- Small Size: 1.06 x 2.02 mm
The HMC342 chip is a GaAs MMIC Low Noise Amplifier (LNA) which covers the frequency range of 13 to 25 GHz. The chip can easily be integrated into Multi-Chip Modules (MCMs) due to its small (2.14 mm²) size. The chip utilizes a GaAs PHEMT process offering 20 dB gain from a single bias supply of +3V @ 41 mA with a noise figure of 3.5 dB. All data is with the chip in a 50 ohm test fixture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length 0.31 mm (<12 mils).
- Microwave Point-to-Point Radios
- Millimeterwave Point-to-Point Radios
- VSAT & SATCOM
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages (Rev. 0)8/9/2019247 K
Thermal Management for Surface Mount Components General Application Note11/11/2015189 K
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
Semiconductor Qualification Test Report: PHEMT-A (QTR: 2013-00267)4/22/2015779 K
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC342||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC342-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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