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HMC265 Die Datasheet10/22/2015
Overview
Features and Benefits
- Integrated LO Amplifier: -4 dBm Input
- Sub-Harmonically Pumped (x2) LO
- Integrated IF Amplifier: 3 dB Gain
- Small Size: 1.32 × 1.32 × 0.1 mm
Product Details
The HMC265 chip is a sub-harmonically pumped (x2) MMIC downconverter with integrated LO & IF amplifiers. The chip utilizes a GaAs PHEMT technology that results in a small overall chip area of 1.74 mm2. The 2LO to RF isolation is excellent eliminating the need for additional filtering. The LO amplifier is a single bias (+3V to +4V) two stage design with only -4 dBm nominal drive requirement. All data is with the chip in a 50 ohm test fixture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils). This downconverter IC is an excellent, smaller, and more reliable replacement to hybrid diode based downconverter MMIC assemblies.
APPLICATIONS
- Microwave Point-to-Point Radios
- LMDS
- SATCOM
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Markets and Technologies
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Tools & Simulations
S-Parameters
ZIP
HMC265 Die S-Parameters
30.82 K
Design Tools
ADIsimRF
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Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC265 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC265-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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