Package/Assembly Qualification Test Report: Plastic Encapsulated SOIC (QTR: 02018 REV: 01)10/29/2015767 K
Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015798 K
PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor Change1/17/2014476 K
HMC Legacy PCN: S## and S##E packages - Relocation of pre-existing production equipment to new building2/1/2013401 K
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Documentation & Resources
Design Techniques Enhance Isolation in Switch Assemblies4/22/2015503 K
SOIC 14 Tape Specification (S14)4/17/2015421 K
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|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC182S14||Material Declaration||Reliability Data||SOIC 150 MIL|
|HMC182S14E||Material Declaration||Reliability Data||SOIC 150 MIL|
|HMC182S14ETR||Material Declaration||Reliability Data||SOIC 150 MIL|
|HMC182S14TR||Material Declaration||Reliability Data||SOIC 150 MIL|
|Wafer Fabrication Data|
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