HMC-auh318 Data Sheet4/22/2015595 K
Features and Benefits
- Gain: 24 dB
- P1dB: +17.5 dBm
- Supply Voltage: +4V
- 50 Ohm Matched Input/Output
- Die Size: 2.65 x 1.60 x 0.05 mm
The HMC-AUH318 is a high dynamic range, three stage GaAs HEMT MMIC Medium Power Amplifier which operates between 71 and 76 GHz. The HMCAUH318 provides 24 dB of gain, and an output power of +17.5 dBm at 1 dB compression from a +4V supply voltage. All bond pads and the die backside are Ti/Au metallized. The HMC-AUH318 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
- Short Haul / High Capacity Links
- Test & Measurement Equipment
- E-Band Communication Systems
Product Lifecycle Last Time Buy
All products in this family will be obsolete soon. Please contact ADI Sales or Distributors to arrange for final purchases and read our Obsolescence Information to review the time periods for placing final orders and receiving final shipments.
Documentation & Resources
Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages (Rev. 0)8/9/2019247 K
Thermal Management for Surface Mount Components General Application Note11/11/2015189 K
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
38, 60 & 82 GHz MMICs for High Capacity Communication Links5/5/2015767 K
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
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|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC-AUH318||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC-AUH318-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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