Not the part you were looking for?
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
Features
- Noise Figure: 5 dB
- P1dB: +7 dBm
- Gain: 14 dB
- Supply Voltage: +2V
- 50 Ohm Matched Input/Output
- Die Size: 3.20 x 1.60 x 0.1 mm
.svg?rev=fd385c90e2cf4716ae9a8c8d20e6b8e3&la=en&h=24&w=24&hash=A302DF48F94BAAA11877AF223F27157A){kind=icon}
The HMC-ALH509 is a three stage GaAs HEM T MMIC Low Noise Amplifier (LNA) which operates between 71 and 86 GHz. The HMC-ALH509 features 14 dB of small signal gain, 5 dB of noise figure and an output power of +7 dBm at 1dB compression from a +2V supply voltage. All bond pads and the die backside are Ti/Au metallized. This versatile LNA is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
Applications
- Short Haul / High Capacity Links
- Automotive Radar
- E-Band Communication Systems
- Test & Measurement
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
{{modalTitle}}
{{modalDescription}}
{{dropdownTitle}}
- {{defaultSelectedText}} {{#each projectNames}}
- {{name}} {{/each}} {{#if newProjectText}}
-
{{newProjectText}}
{{/if}}
{{newProjectTitle}}
{{projectNameErrorText}}
HMC-ALH509-DIE
Documentation
Filters
1 Applied
-
All
-
Technical Articles
-
Data Sheet
-
Application Note
-
All
-
English
-
Chinese
-
Japanese
Technical Articles
1
Application Note
6
HTML
HTML
HTML
HTML
HTML
Documentation
Data Sheet 1
Application Note 3
Technical Articles 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| HMC-ALH509 | CHIPS OR DIE |
|
|
| HMC-ALH509-SX | CHIPS OR DIE |
|
- HMC-ALH509
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- HMC-ALH509-SX
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Sep 3, 2020
- 20_0057
Discontinuance of Model Numbers: HMC549MS8GE, HMC375LP3E, HMC382LP3E, HMC-AUH318, HMC-ALH508, HMC-AUH317G, HMC-ALH509G, HMC-ALH311, HMC-APH460, HMC-AUH232, HMC-APH196
HMC-ALH509
HMC-ALH509-SX
Filter by Model
Part Models
Product Lifecycle
PCN
Sep 3, 2020
- 20_0057
Discontinuance of Model Numbers: HMC549MS8GE, HMC375LP3E, HMC382LP3E, HMC-AUH318, HMC-ALH508, HMC-AUH317G, HMC-ALH509G, HMC-ALH311, HMC-APH460, HMC-AUH232, HMC-APH196
Software & Part Ecosystem
Tools & Simulations 3
ADIsimRF
S-Parameter 1
S-Parameter
Sys-Parameter