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HMC-ALH311 Data Sheet4/22/2015
Alternative Parts
Overview
Features and Benefits
- P1dB Output Power: +12 dBm
- Gain: 25 dB
- Noise Figure: 3 dB @ 25 GHz
- Supply Voltage: +2.5V @ 52 mA
- Die Size: 1.80 x 0.73 x 0.1 mm
Product Details
The HMC-ALH311 is a GaAs MMIC HEMT Low Noise Driver Amplifier die which operates between 22 and 26.5 GHz. The amplifier provides 25 dB of gain, a typical noise figure of 3 dB at 25 GHz, and +12 dBm of output power at 1 dB gain compression while requiring only 52 mA from a +2.5V supply voltage. The HMCALH311 is ideal for microwave radio driver amplifier applications between 22 to 26.5 GHz. Due to its small size, the HMC-ALH311 die is ideal for integration into Multi-Chip-Modules (MCMs).
Applications
- Point-to-Point Radios
- Point-to-Multi-Digital Radios
- Military & Space
- Test Instrumentation
Product Categories
Product Lifecycle
Last Time Buy
All products in this family will be obsolete soon. Please contact ADI Sales or Distributors to arrange for final purchases and read our Obsolescence Information to review the time periods for placing final orders and receiving final shipments.
Documentation & Resources
Tools & Simulations
Sys-Parameter
Sys-Parameter Models for Keysight Genesys
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
Design Tool
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC-ALH311 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC-ALH311-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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