HMC-ALH310 Data Sheet4/22/2015
Features and Benefits
- Noise Figure: 3.5 dB
- P1dB: +12 dBm
- Gain: 22 dB
- Supply Voltage: +2.5V
- 50 Ohm Matched Input/Output
- Die Size: 1.80 x 0.73 x 0.1 mm
The HMC-ALH310 is a three stage GaAs HEMT MMIC Low Noise Amplifier (LNA) which operates between 37 and 42 GHz. The HMC-ALH310 features 22 dB of small signal gain, 3.5 dB of noise figure and an output power of +12 dBm at 1 dB compression from a +2.5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.
This versatile LNA is compatible with conventional die attach methods, as well as thermocompression and thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
- Point-to-Point Radios
- Point-to-Multi-Point Radios
- Military & Space
Product Lifecycle Last Time Buy
All products in this family will be obsolete soon. Please contact ADI Sales or Distributors to arrange for final purchases and read our Obsolescence Information to review the time periods for placing final orders and receiving final shipments.
Documentation & Resources
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC-ALH310||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC-ALH310-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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