DAC8412
Info: : PRODUCTION
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DAC8412

Quad, 12-Bit DAC Voltage Output with Readback

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Models 10
1ku List Price Starting From $50.55
Features
  • +5 V to ±15 V operation
  • Unipolar or bipolar operation
  • True voltage output
  • Double-buffered inputs
  • Reset to minimum (DAC8413) or center scale (DAC8412)
  • Fast bus access time
  • Readback
Additional Details
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The DAC8412 / DAC8413 are quad, 12-bit voltage output DACs with readback capability. Built using a complementary BiCMOS process, these monolithic DACs offer the user very high package density.

Output voltage swing is set by the two reference inputs VREFH and VREFL. By setting the VREFL input to 0 V and VREFH to a positive voltage, the DAC provides a unipolar positive output range. A similar configuration with VREFH at 0 V and VREFL at a negative voltage provides a unipolar negative output range. Bipolar outputs are configured by connecting both VREFH and VREFL to nonzero voltages. This method of setting output voltage range has advantages over other bipolar offsetting methods because it is not dependent on internal and external resistors with different temperature coefficients.

Digital controls allow the user to load or read back data from any DAC, load any DAC, and transfer data to all DACs at one time.

An active low RESET loads all DAC output registers to midscale for the DAC8412 and zero scale for the DAC8413.

The DAC8412 / DAC8413 are available in 28-lead plastic DIP, 28-lead ceramic DIP, 28-lead PLCC, and 28-lead LCC packages.

They can be operated from a wide variety of supply and reference voltages with supplies ranging from single +5 V to ±15 V, and references from +2.5 V to ±10 V. Power dissipation is less than 330 mW with ±15 V supplies and only 60 mW with a +5 V supply.

For MIL-STD-883 applications, contact your local Analog Devices, Inc. sales office for the DAC8412/DAC8413/883 data sheet, which specifies operation over the −55°C to +125°C temperature range. All 883 parts are also available on Standard Military Drawings 5962-91 76401MXA through 76404M3A.

APPLICATIONS

  • Automatic test equipment
  • Digitally controlled calibration
  • Servo controls
  • Process control equipment
Part Models 10
1ku List Price Starting From $50.55

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-9176401MXA
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5962-9176402M3A
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5962-9176402MXA
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DAC8412AT/883C
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DAC8412BT/883C
  • HTML
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DAC8412BTC/883C
  • HTML
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DAC8412EPZ
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DAC8412FPCZ
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DAC8412FPCZ-REEL
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DAC8412FPZ
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Filter by Model

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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Jul 31, 2009

- 09_0106

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Oct 1, 2009

- 09_0194

DAC8412/3 redesign and fab process change

DAC8412EPZ

PRODUCTION

DAC8412FPCZ

PRODUCTION

DAC8412FPCZ-REEL

PRODUCTION

DAC8412FPZ

PRODUCTION

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Jun 13, 2008

- 08_0065

Transfer of product to 8" H6 Thin Film Process with Polyimide Layer

DAC8412EPZ

PRODUCTION

DAC8412FPCZ

PRODUCTION

DAC8412FPCZ-REEL

PRODUCTION

DAC8412FPZ

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Jul 31, 2009

- 09_0106

arrow down

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

5962-9176401MXA

5962-9176402M3A

5962-9176402MXA

DAC8412AT/883C

PRODUCTION

DAC8412BT/883C

DAC8412BTC/883C

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Oct 1, 2009

- 09_0194

arrow down

DAC8412/3 redesign and fab process change

DAC8412EPZ

PRODUCTION

DAC8412FPCZ

PRODUCTION

DAC8412FPCZ-REEL

PRODUCTION

DAC8412FPZ

PRODUCTION

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Jun 13, 2008

- 08_0065

arrow down

Transfer of product to 8" H6 Thin Film Process with Polyimide Layer

DAC8412EPZ

PRODUCTION

DAC8412FPCZ

PRODUCTION

DAC8412FPCZ-REEL

PRODUCTION

DAC8412FPZ

PRODUCTION

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