ADSP-BF607
PRODUCTIONBlackfin Dual-Core Processor up to 1GHz for High Performance Digital Signal Processing Applications
- Part Models
- 2
- 1ku List Price
- Starting From $21.18
Part Details
- 2 Blackfin cores capable of 500 MHz/1000 MMACs (2000 MMACs total) for demanding signal processing applications.
- 552 K bytes of on-chip SRAM composed of 148kB of L1 SRAM per core with parity support and a shared L2 256kB SRAM with ECC support.
- Fully integrated DMA controller supporting DMA transfers to and from all on-chip and off-chip memories and peripherals.
- 3x Enhanced Parallel Peripheral Interfaces (ePPIs) supporting up to 24-bit data widths, ITU-R BT.656 modes, and direct connection to TFT LCD panels, parallel converters, video encoders and decoders, image sensors, and other general-purpose peripherals.
- 3 synchronous serial ports (SPORTs) supporting I2S, Packed I2S, left-justified sample pair, and TDM modes.
- USB 2.0 HS OTG.
- Removable Storage Interface (RSI).
- Controller Area Network (CAN) Interface.
- 2 10/100 Ethernet MACs with IEEE 1588 support.
- 4 Link Ports supporting 8-bit wide DMA enabled data transfer.
- 2 Watch Dog Timers and 8 Timer/Counters with PWM support.
- CRC engine.
- 2 SPI-compatible ports supporting master and slave modes.
- 2 UART and 2 Two-Wire Interfaces.
- 2 16-bit Pulse Width Modulation (PWM) channels.
- 19x19 mm CSP BGA package.
- Commercial and Industrial temperature ranges available.
The dual-core ADSP-BF607 Blackfin processor is optimized for a broad range of industrial, instrumentation, medical, and consumer applications demanding complex control and signal processing tasks while maintaining extremely high data throughput.
Features include a high performance enhanced infrastructure, large on-chip memory and a feature rich peripheral set with expanded connectivity options including USB 2.0 HS OTG, 2 10/100 Ethernet MACs, and Removable Storage Interface (RSI).
In addition to these the ADSP-BF607 processor contains features for safety-critical applications, including a CRC for memory protection, Parity and ECC protection in the internal memory blocks and a Fault Management Unit.
EDN China Innovation Award Winner 2012
Documentation
Data Sheet 1
User Guide 4
Application Note 15
Processor Manual 2
Emulator Manual 3
Integrated Circuit Anomaly 1
Informational 1
Video 3
Legacy Evaluation Kit Manual 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADSP-BF607BBCZ-5 | 349-Ball CSPBGA (19mm x 19mm) | ||
| ADSP-BF607KBCZ-5 | 349-Ball CSPBGA (19mm x 19mm) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
| No Match Found | ||
|
Feb 7, 2014 - 14_0033 Die Revision for ADSP-BF60x Blackfin Processors |
||
| ADSP-BF607BBCZ-5 | PRODUCTION | |
| ADSP-BF607KBCZ-5 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Lightweight TCP/IP (lwIP) Stack
OBSOLETE: The Lightweight TCP/IP (lwIP) Stack for CrossCore Embedded Studio is an implementation of this widely accepted TCP/IP stack for embedded platforms supporting most of the networking protocols in the TCP/IP suite.
View DetailsCrossCore® Embedded Studio
CCES is a world-class integrated development environment (IDE) for the ADI Blackfin®, SHARC® and Arm® processor families.
View DetailsEvaluation Software 0
Tools & Simulations
Evaluation Kits
The ADSP-BF609 EZ-Board evaluation hardware provides a low-cost hardware solution for evaluating the ADSP-BF60x Blackfin processor family.
Resources
Low Cost ICE-1000 and High Performance ICE-2000 USB-based JTAG Emulators