ADIN1300
Robust, Industrial, Low Latency and Low Power 10 Mbps, 100 Mbps, and 1 Gbps Ethernet PHY
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Features
- 10BASE-Te/100BASE-TX/1000BASE-T IEEE 802.3 compliant
- MII, RMII, and RGMII MAC interfaces
- 1000BASE-T RGMII latency transmit <68 ns, receive <226 ns
- 100BASE-TX MII latency transmit <52 ns, receive <248 ns
- Programmable RGMII timing delay and drive current
- Supports TSN
- EMC test standards
- IEC 61000-4-5 surge (±4 kV)
- IEC 61000-4-4 electrical fast transient (EFT) (±4 kV)
- IEC 61000-4-2 ESD (±6 kV contact discharge)
- IEC 61000-4-6 conducted immunity (10 V)
- EN55032 radiated and conducted emissions (Class A)
- Unmanaged configuration using multilevel pin strapping
- MDIO/MDC management interface and interrupt pin
- EEE in accordance with IEEE 802.3az
- Start of packet detection for IEEE 1588 time stamp support
- Enhanced link detection
- Voltage mode MDI drivers, eliminates termination resistors
- RJ45 MDI flip capability
- Automatic polarity and pair swap correction
- Cable diagnostics (TDR and signal analysis)
- Frame generator and checker, multiple loopback modes
- Configurable LED
- Crystal oscillator frequency/25 MHz clock input frequency (50 MHz for RMII)
- 25 MHz/125 MHz synchronous clock output
- Jumbo frame support up to 16 kB
- Small package and wide temperature range
- 40-lead, 6 mm × 6 mm LFCSP
- Specified for −40°C to +105°C ambient operation
- Low power consumption
- 330 mW for 1000BASE-T
- 140 mW for 100BASE-TX
- 3.3 V/2.5 V/1.8 V MAC interface VDDIO supply
- Integrated power supply monitoring and POR
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The ADIN1300 is a low power, single port, Gigabit Ethernet transceiver with low latency and power consumption specifications primarily designed for industrial Ethernet applications.
This design integrates an energy efficient Ethernet (EEE) physical layer device (PHY) core with all associated common analog circuitry, input and output clock buffering, management interface and subsystem registers, and MAC interface and control logic to manage the reset and clock control and pin configuration.
The ADIN1300 is available in a 6 mm × 6 mm, 40-lead lead frame chip scale package (LFCSP). The device operates with a minimum of 2 power supplies, 0.9 V and 3.3 V, assuming the use of a 3.3 V MAC interface supply. For maximum flexibility in system level design, a separate VDDIO supply enables the management data input/output (MDIO) and MAC interface supply voltages to be configured independently of the other circuitry on the ADIN1300, allowing operation at 1.8 V, 2.5 V, or 3.3 V. At power-up, the ADIN1300 is held in hardware reset until each of the supplies has crossed its minimum rising threshold value. Brown-out protection is provided by monitoring the supplies to detect if one or more supply drops below a minimum falling threshold (see Table 19 on the datasheet), and holding the device in hardware reset until the power supplies return and satisfy the power-on reset (POR) circuit.
The MII management interface (also referred to as MDIO interface) provides a 2-wire serial interface between a host processor or MAC (also known as management station (STA)) and the ADIN1300, allowing access to control and status information in the PHY core management registers. The interface is compatible with both the IEEE 802.3 Standard Clause 22 and Clause 45 management frame structures.
The ADIN1300 can support cable lengths up to 150 meters at Gigabit speeds and 180 meters when operating at 100 Mbps or 10 Mbps.
Applications
- Industrial automation
- Process control
- Factory automation
- Robotics/motion control
- Time sensitive networking (TSN)
- Building automation
- Test and measurement
- Industrial internet of things (IoT)
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ADIN1300
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Data Sheet
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ADIN1300: Robust, Industrial, Low Latency and Low Power 10 Mbps,100 Mbps, and 1 Gbps Ethernet PHY Data Sheet (Rev.B)
ADIN1300: 10Mbps および 100Mbps の堅牢な産業用低遅延、低消費電力イーサネット PHY データシート
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Application Note 13
AN-2047: Configuring the ADIN1300 Ethernet PHY (Rev.0)
PHY Exchange Guide, AR8035 to ADIN1300 Gb
PHY Exchange Guide, DP83867 to ADIN1300 Gb
PHY Exchange Guide, DP83869 to ADIN1300 Gb
PHY Exchange Guide, AR8031/8033 to ADIN1300 Gb
PHY Exchange Guide, DP83822 to ADIN1200 10/100Mb
PHY Exchange Guide, DP83825 to ADIN1200 10/100Mb
PHY Exchange Guide, Marvell Alaska 88E1512 to ADIN1300 Gb
PHY Exchange Guide, Marvell Alaska 88E1510 to ADIN1300 Gb
PHY Exchange Guide, KSZ8081RNB/MNX to ADIN1200 10/100Mb
Configuring the ADIN1300 for Ethernet PHY Compliance Test Modes
Configuring the ADIN1200 for Ethernet PHY Compliance Test Modes
ADIN1300 and ADIN1200 with Capacitive Coupling
Technical Articles 3
Frequently Asked Question 1
Device Drivers 2
Solutions Bulletin & Brochure 3
Webcast 8
Thought Leadership Page 4
Video
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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| ADIN1300BCPZ |
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
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| ADIN1300BCPZ-R7 |
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
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| ADIN1300CCPZ |
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
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| ADIN1300CCPZ-R7 |
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
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- ADIN1300BCPZ
- Pin/Package Drawing
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40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADIN1300BCPZ-R7
- Pin/Package Drawing
-
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADIN1300CCPZ
- Pin/Package Drawing
-
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADIN1300CCPZ-R7
- Pin/Package Drawing
-
40-Lead LFCSP (6mm x 6mm x 0.75mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 10, 2022
- 22_0277
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADIN1300BCPZ
PRODUCTION
ADIN1300BCPZ-R7
PRODUCTION
ADIN1300CCPZ
PRODUCTION
ADIN1300CCPZ-R7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 10, 2022
- 22_0277
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADIN1300BCPZ
PRODUCTION
ADIN1300BCPZ-R7
PRODUCTION
ADIN1300CCPZ
PRODUCTION
ADIN1300CCPZ-R7
PRODUCTION
Software & Part Ecosystem
Device Drivers
ADIN1200/ADIN1300 Non Operating System Driver
Looking for Evaluation Software? You can find it here
Can't find the software or driver you need?
Request a Driver/SoftwareEvaluation Kits 3
AD-JUPITER-EBZ
Software-Defined Radio
Features and Benefits
- RF/SDR
- ADRV9002 transceiver
- 2 x receiver, 2 x transmitter
- LO frequency range 30 MHz to 6 GHz
- 12 kHz to 40 MHz frequency bandwidth
- Sampling rate 12 kSPS to 61.44 MSPS
- External Device Clock Input
- External MCS Input
- RF Front-end
- Processing System
- Zynq UltraScale+ MPSoC XCZU3EG
- ARM Cortex-A53 1.5 GHz
- ARM Cortex-R5 500 MHz
- Mali-400 MP2 graphic processor
- Programmable logic 154 k
- DDR4 – 2 GB (x32)
- Boot source
- SD card 3.0
- Flash memory 128 MB
- User Interfaces
- USB 3.1 Gen 1 – Type C
- Upstream Facing Port (UFP)
- Downstream Facing Port (DFP)
- USB 2.0 compatible
- Ethernet 1000BASE-T RGMII
- Display Port v1.2 (2 lanes, 5.4 Gbps)
- SATA 3
- USB (micro) debug interface
- 16 GPIOs (3V3 LVCMOS)
- USB Type-C (power only)
- Power Sink 5V, 9V/3A
- USB Type-C (data)
- Power Sink 5V/3A
- Power Source 5V/0.9 A
- 802.3at POE compliant, 25.5 W Type2 (POE+)
Product Detail
The AD-JUPITER-EBZ is a versatile software-defined platform based on Analog Devices ADRV9002 and Xilinx Zynq UltraScale+ MPSoC. The ADRV9002 is a new generation RF transceiver that has dual-channel transmitters, dual-channel receivers covering a frequency range of 30 MHz to 6 GHz. This device has a high-quality RF linearity performance and a set of advanced features like fast profiles switching, flexible power vs. performance configuration, fast frequency hopping, multi-chip synchronization, and digital pre-distortion (DPD) for narrow and wide band waveform.
The evaluation platform includes XCZU3EG processing device that has a wide range of interfaces, making the system capable of local processing or streaming to a remote host. It comes integrated in a self-contained ruggedized aluminum case, which gives flexibility in evaluating and prototyping across different environments.
APPLICATIONS
- Aerospace and Defense
- Communications
- Advanced Education
EVAL-ADIN1300
ADIN1300 Evaluation Board
Product Detail
The EVAL-ADIN1300FMCZ allows simplified evaluation of the key features of the ADIN1300 robust, industrial, low latency 10 Mbps, 100 Mbps, 1 Gbps Ethernet physical layer (PHY). The evaluation board is powered by a single, external, 5 V supply. All chip supplies are regulated from this 5 V rail providing supply rails AVDD3P3, VDD0P9 and VDDIO for the device.
The P3 field programmable gate array (FPGA) mezzanine connector (FMC) is provided for connection to a master FPGA system for the media access control (MAC) interface and management data input/output (MDIO) control.
The MDIO can also be controlled via an optional MDIO interface dongle included as part of the kit.
Resources
ADMV96S-WGBE-EK1
60 GHz Wireless Connector
Features and Benefits
- Allows evaluation and prototyping of 60 GHz wireless data links to replace traditional mechanical connectors in moving joints
- 1 Gbps Ethernet interface on both sides of the wireless data link
- Fully programmable system allowing ultimate flexibility for custom developments
- Open-source software stack for firmware development
- Open-source GUI for system configuration, monitoring, and control
Product Detail
The ADMV96S-WGBE-EK1 is a complete evaluation and prototyping system for 60 GHz wireless data links. It consists of a pair of receiver and transmitter boards with a 1Gbp Ethernet interface on each side of the wireless link.
The 60 GHz wireless link is implemented by the ADMV9615 and ADMV9525 modules. These are coupled with a SerDes device which translates the modules’ SGMII interface to RGMII so that it can be connected to an ADIN1300 industrial low latency and low power 1 Gbps Ethernet PHY. This enables each side of the wireless link to act as an Ethernet port and essentially create a seamless wire-like connection between two ends of an Ethernet cable.
The on-board MAX32650 ultralow power ARM® Cortex®-M4 microcontroller controls the system’s operation and implements the algorithms to configure the wireless link in real time so that optimal link quality is constantly maintained over temperature and various operating conditions. An open-source software stack is provided for firmware development as well as reference applications. The MAX32650 can be programmed through a programming port which can also be used for firmware debugging.
The two sides of the wireless link are mounted on an adjustable rail so that the system can be configured and tested for various distances between the links. Each side of the link is powered from an external 12 V power supply.
An open-source GUI is provided for system configuration, monitoring, and control from a host PC.
APPLICATIONS
- 60 GHz wireless data links for industrial and medical high data rate applications
- High speed data for rotating applications, such as slip rings and magnetic resonance imaging systems
- Autonomous guided vehicles
- Mechanical Connector replacement
Resources
Tools & Simulations 1
IBIS Model 1
IBIS Model
Reference Designs 1
CN0506
10 Mbps/100 Mbps/1000 Mbps Dual Channel, Low Power Industrial Ethernet PHY
Circuits from the lab
Info:Circuits from the lab
