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Features
- 0.5 Ω typical on resistance
- 0.8 Ω maximum on resistance at 125°C
- 1.65 V to 3.6 V operation
- Automotive temperature range: –40°C to +125°C
- High current carrying capability: 300 mA continuous
- Rail-to-rail switching operation
- Fast-switching times <20 ns
- Typical power consumption (<0.1 µW)
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The ADG836 is a low voltage complementary metal-oxide semiconductor (CMOS) device containing two independently selectable single-pole, double-throw (SPDT) switches. This device offers an ultralow on resistance of less than 0.8 Ω over the full temperature range. The ADG836 is fully specified for 3.3 V, 2.5 V, and 1.8 V supply operation.
Each switch conducts equally well in both directions when on, and has an input signal range that extends to the supplies. The ADG836 exhibits break-before-make switching action.
The ADG836 is available in a 10-lead MSOP and in a 3 mm × 3 mm 12-lead LFCSP.
Product Highlights
- <0.8 Ω over full temperature range of –40°C to +125°C.
- Single 1.65 V to 3.6 V operation.
- Compatible with 1.8 V CMOS logic.
- High current handling capability (300 mA continuous current at 3.3 V).
- Low total harmonic distortion plus noise (THD + N) (0.02% typical).
- 3 mm × 3 mm LFCSP and 10-lead MSOP.
- Cellular phones
- PDAs
- MP3 players
- Power routing
- Battery-powered systems
- PCMCIA cards
- Modems
- Audio and video signal routing
- Communication systems
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG836
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG836YCPZ-REEL7 |
12-Lead LFCSP (3mm x 3mm x 0.75mm)
|
|
|
| ADG836YRMZ |
10-Lead MSOP
|
|
|
| ADG836YRMZ-REEL |
10-Lead MSOP
|
|
|
| ADG836YRMZ-REEL7 |
10-Lead MSOP
|
|
- ADG836YCPZ-REEL7
- Pin/Package Drawing
-
12-Lead LFCSP (3mm x 3mm x 0.75mm)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG836YRMZ
- Pin/Package Drawing
-
10-Lead MSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG836YRMZ-REEL
- Pin/Package Drawing
-
10-Lead MSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG836YRMZ-REEL7
- Pin/Package Drawing
-
10-Lead MSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 19, 2020
- 20_0174
ADG811, ADG812, ADG836, ADG836L, ADG804 Ron specification changes
ADG836YCPZ-REEL7
PRODUCTION
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Nov 2, 2015
- 15_0156
ADG836 Wafer Fabrication Change from TSMC Fab 7A to TSMC Fab 11
ADG836YCPZ-REEL7
PRODUCTION
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Feb 13, 2014
- 14_0038
Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG836YCPZ-REEL7
PRODUCTION
Mar 22, 2021
- 21_0001
Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Oct 30, 2017
- 15_0176
Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
May 15, 2012
- 10_0006
Halogen Free Material Change for mini SOIC Products
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 19, 2020
- 20_0174
ADG811, ADG812, ADG836, ADG836L, ADG804 Ron specification changes
ADG836YCPZ-REEL7
PRODUCTION
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Nov 2, 2015
- 15_0156
ADG836 Wafer Fabrication Change from TSMC Fab 7A to TSMC Fab 11
ADG836YCPZ-REEL7
PRODUCTION
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Feb 13, 2014
- 14_0038
Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG836YCPZ-REEL7
PRODUCTION
Mar 22, 2021
- 21_0001
Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Oct 30, 2017
- 15_0176
Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
May 15, 2012
- 10_0006
Halogen Free Material Change for mini SOIC Products
ADG836YRMZ
PRODUCTION
ADG836YRMZ-REEL
PRODUCTION
ADG836YRMZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-10MSOP
Evaluation Board for 10-Lead MSOP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-10MSOPEBZ evaluation board evaluates 10-lead MSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-10MSOPEBZ to secure a 10-lead MSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 10-lead MSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K10 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
To launch ready-to-run LTspice demonstration circuits for this part:
Step 1: Download and install LTspice on your computer.
Step 2: Click on the link in the section below to download a demonstration circuit.
Step 3: If LTspice does not automatically open after clicking the link below, you can instead run the simulation by right clicking on the link and selecting “Save Target As.” After saving the file to your computer, start LTspice and open the demonstration circuit by selecting ‘Open’ from the ‘File’ menu.
Lt Spice
Reference Designs 1
CN0411
TDS Measurement System for Water Quality Monitoring
Circuits from the lab
Info:Circuits from the lab
