ADG836

PRODUCTION

0.5 Ω CMOS, 1.65 V TO 3.6 V, Dual SPDT/2:1 MUX

Data Sheet (Rev. C) Product Selection Table

Part Models: 4
1ku List Price: Starting From $1.56

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Part Details

0.5 Ω typical on resistance
0.8 Ω maximum on resistance at 125°C
1.65 V to 3.6 V operation
Automotive temperature range: –40°C to +125°C
High current carrying capability: 300 mA continuous
Rail-to-rail switching operation
Fast-switching times <20 ns
Typical power consumption (<0.1 µW)

Part Models: 4
1ku List Price: Starting From $1.56

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG836YCPZ-REEL7	12-Lead LFCSP (3mm x 3mm x 0.75mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG836YRMZ	10-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG836YRMZ-REEL	10-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG836YRMZ-REEL7	10-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Aug 19, 2020 - 20_0174 ADG811, ADG812, ADG836, ADG836L, ADG804 Ron specification changes
		PCN20_0174_Form Material_Report Datasheet Specification Comparison
ADG836YCPZ-REEL7	PRODUCTION
ADG836YRMZ	PRODUCTION
ADG836YRMZ-REEL	PRODUCTION
ADG836YRMZ-REEL7	PRODUCTION
Nov 2, 2015 - 15_0156 ADG836 Wafer Fabrication Change from TSMC Fab 7A to TSMC Fab 11
		PCN15_0156_Form Material_Report Qualification Results Summary
ADG836YCPZ-REEL7	PRODUCTION
ADG836YRMZ	PRODUCTION
ADG836YRMZ-REEL	PRODUCTION
ADG836YRMZ-REEL7	PRODUCTION
Feb 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0038_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADG836YCPZ-REEL7	PRODUCTION
Mar 22, 2021 - 21_0001 Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP
		PCN21_0001_Form Material_Report Other Qualification Results Summary
ADG836YRMZ	PRODUCTION
ADG836YRMZ-REEL	PRODUCTION
ADG836YRMZ-REEL7	PRODUCTION
Oct 30, 2017 - 15_0176 Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
		PCN15_0176_Form Material_Report Detailed Change Description Qualification Results Summary Qualification Results Summary
ADG836YRMZ	PRODUCTION
ADG836YRMZ-REEL	PRODUCTION
ADG836YRMZ-REEL7	PRODUCTION
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADG836YRMZ	PRODUCTION
ADG836YRMZ-REEL	PRODUCTION
ADG836YRMZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

ADG836

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Evaluation Board for 10-Lead MSOP Devices in the Switches and Multiplexers Portfolio

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Features and Benefits

10-lead MSOP evaluation board
Clamp allows the main device to be easily changed
Gold pin connectors allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on-board to allow for prototyping

Product Details

The EVAL-10MSOPEBZ evaluation board evaluates 10-lead MSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-10MSOPEBZ to secure a 10-lead MSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 10-lead MSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K10 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.