AD704
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AD704

Picoampere Input Current Quad Bipolar Op Amp

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Part Details
Part Models 6
1ku List Price Starting From $7.05
Features
  • High dc precision
    150 μV maximum offset voltage
    1.5 μV/°C maximum offset voltage drift
    270 pA maximum input bias current
    0.3 pA/°C typical IB drift
  • Low noise: 0.5 μV p-p
  • Typical noise: 0.1 Hz to 10 Hz
  • Low power: 600 μA maximum supply current per amplifier
  • Dual version: AD706
Additional Details
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The AD704 is a quad, low power bipolar op amp that has the low input bias current of a BiFET amplifier and offers a significantly lower IB drift over temperature. It uses superbeta bipolar input transistors to achieve picoampere input bias current levels (similar to FET input amplifiers at room temperature), while its IB typically increases only by 5× at 125°C (unlike a BiFET amp, for which IB doubles every 10°C, resulting in a 1000× increase at 125°C). In addition, the AD704 achieves 150 μV offset voltage and the low noise characteristics of a precision bipolar input op amp.

Because it has only 1/20 the input bias current of an OP07, the AD704 does not require the commonly used balancing resistor. Furthermore, the current noise is 1/5 that of the OP07, which makes the AD704 usable with much higher source impedances. At 1/6 the supply current (per amplifier) of the OP07, the AD704 is better suited for today’s higher density circuit boards and battery-powered applications.

The AD704 is an excellent choice for use in low frequency active filters in 12- and 14-bit data acquisition systems, in precision instrumentation, and as a high quality integrator. The AD704 is internally compensated for unity gain stability. The AD704J is rated over the commercial temperature range of 0°C to 70°C. The AD704A is rated over the industrial temperature of −40°C to +85°C. The AD704S is rated over the military temperature range of −55°C to +125°C, processed to MIL-STD-883B.

APPLICATIONS

  • Industrial/process controls
  • Weigh scales
  • ECG/EKG instrumentation
  • Low frequency active filters
Part Models 6
1ku List Price Starting From $7.05

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD704ARZ-16
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AD704ARZ-16-REEL
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AD704JNZ
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AD704JRZ-16
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AD704JRZ-16-REEL
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AD704SE/883B
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Part Models

Product Lifecycle

PCN

Dec 21, 2012

- 12_0254

AD704 Polyimide Thickness Change

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JNZ

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JNZ

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

AD704SE/883B

PRODUCTION

Aug 4, 2010

- 10_0117

Halogen Free Material Change for SOIC_W Products at Carsem

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

Mar 29, 2021

- 21_0033

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Jul 31, 2009

- 09_0106

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Dec 21, 2012

- 12_0254

arrow down

AD704 Polyimide Thickness Change

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JNZ

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JNZ

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

AD704SE/883B

PRODUCTION

Aug 4, 2010

- 10_0117

arrow down

Halogen Free Material Change for SOIC_W Products at Carsem

AD704ARZ-16

PRODUCTION

AD704ARZ-16-REEL

PRODUCTION

AD704JRZ-16

PRODUCTION

AD704JRZ-16-REEL

PRODUCTION

Mar 29, 2021

- 21_0033

arrow down

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Jul 31, 2009

- 09_0106

arrow down

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

Software & Part Ecosystem

Software & Part Ecosystem

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