AD669
Info: : PRODUCTION
searchIcon
cartIcon

AD669

Monolithic 16-Bit DACPORT

Show More showmore-icon

Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 8
1ku List Price Starting From $26.92
Features
  • Complete 16-Bit D/A Function
    On-Chip Output Amplifier
    High Stability Buried Zener Reference
  • Monolithic BiMOS II Construction
  • ± LSB Integral Linearity Error
  • 15-Bit Monotonic over Temperature
  • Fast 40 ns Write Pulse
  • Microprocessor Compatible
    16-Bit Parallel Input
    Double-Buffered Latches
  • Unipolar or Bipolar Output
  • Low Glitch: 15 nV-s
  • Low THD+N: 0.009%
  • MIL-STD-883 Compliant Versions Available
Additional Details
show more Icon

The AD669 DACPORT® is a complete 16-bit monolithic D/A converter with an on-board reference and output amplifier. It is manufactured on Analog Devices' BiMOS II process. This process allows the fabrication of low power CMOS logic functions on the same chip as high precision bipolar linear circuitry. The AD669 chip includes current switches, decoding logic, an output amplifier, a buried Zener reference and double-buffered latches.

The AD669's architecture insures 15-bit monotonicity over temperature. Integral nonlinearity is maintained at ±0.003%, while differential nonlinearity is ±0.003% max. The on-chip output amplifier provides a voltage output settling time of 10 ms to within 1/2 LSB for a full-scale step.

Data is loaded into the AD669 in a parallel 16-bit format. The double-buffered latch structure eliminates data skew errors and provides for simultaneous updating of DACs in a multi-DAC system. Three TTL/LSTTL/5 V CMOS compatible signals control the latches: CS, L1 and LDAC.

The output range of the AD669 is pin programmable and can be set to provide a unipolar output range of 0 V to +10 V or a bipolar output range of -10 V to +10 V.

The AD669 is available in seven grades: AN and BN versions are specified from -40°C to +85°C and are packaged in a 28-pin plastic DIP. The AR and BR versions are specified for -40°C to +85°C operation and are packaged in a 28-pin SOIC. The SQ version is specified from -55°C to +125°C and is packaged in a hermetic 28-pin cerdip package. The AD669 is also available compliant to MIL-STD-883. Refer to the AD669/883B data sheet for specifications and test conditions.

PRODUCT HIGHLIGHTS

  1. The AD669 is a complete voltage output 16-bit DAC with voltage reference and digital latches on a single IC chip.
  2. The internal buried Zener reference is laser trimmed to 10.000 volts with a ±0.2% maximum error. The reference voltage is also available for external applications.
  3. The AD669 is both dc and ac specified. DC specs include ±1 LSB INL error and ±1 LSB DNL error. AC specs include 0.009% THD+ N and 83 dB SNR. The ac specifications make the AD669 suitable for signal generation applications.
  4. The double-buffered latches on the AD669 eliminate data skew errors while allowing simultaneous updating of DACs in multi-DAC systems.
  5. The output range is a pin-programmable unipolar 0 V to +10 V or bipolar –10 V to +10 V output. No external components are necessary to set the desired output range.
  6. The AD669 is available in versions compliant with MIL-STD-883. Refer to the Analog Devices Military Products Databook or current AD669/883B data sheet for detailed specifications. 
Part Models 8
1ku List Price Starting From $26.92

close icon
Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD669ANZ
  • HTML
  • HTML
AD669ARZ
  • HTML
  • HTML
AD669ARZ-REEL
  • HTML
  • HTML
AD669BNZ
  • HTML
  • HTML
AD669BRZ
  • HTML
  • HTML
AD669BRZ-REEL
  • HTML
  • HTML
AD669SQ
  • HTML
  • HTML
AD669SQ/883B
  • HTML
  • HTML

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Jul 11, 2012

- 12_0142

AD669 Improved ESD Performance

AD669ANZ

PRODUCTION

AD669ARZ

PRODUCTION

AD669ARZ-REEL

PRODUCTION

AD669BNZ

PRODUCTION

AD669BRZ

PRODUCTION

AD669BRZ-REEL

PRODUCTION

AD669SQ

AD669SQ/883B

PRODUCTION

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

AD669SQ

AD669SQ/883B

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

AD669SQ

AD669SQ/883B

PRODUCTION

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Feb 1, 2010

- 10_0020

Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Jul 11, 2012

- 12_0142

arrow down

AD669 Improved ESD Performance

AD669ANZ

PRODUCTION

AD669ARZ

PRODUCTION

AD669ARZ-REEL

PRODUCTION

AD669BNZ

PRODUCTION

AD669BRZ

PRODUCTION

AD669BRZ-REEL

PRODUCTION

AD669SQ

AD669SQ/883B

PRODUCTION

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

AD669SQ

AD669SQ/883B

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

AD669SQ

AD669SQ/883B

PRODUCTION

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Feb 1, 2010

- 10_0020

arrow down

Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.

Software & Part Ecosystem

Software & Part Ecosystem

Can't find the software or driver you need?

Request a Driver/Software
Tools & Simulations

Tools & Simulations 1

Recently Viewed