HMC619

Obsolete

HMC619

HMC619 / HMC619LP5

Power Amplifier Chip or SMT, DC to 10 GHz

Obsolete

Suggested Replacement Parts

HMC637A-Die

GaAs MMIC 1 WATT POWER AMPLIFIER DC - 6 GHz

Obsolete

HMC619 / HMC619LP5

Power Amplifier Chip or SMT, DC to 10 GHz

Not the part you were looking for?

Go to Product Selection Table

View All Documentation

Ask a Question

Submit your question below and we will return the best answer from ADI’s knowledge database:

Other places you can find help

Support

Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

Visit the ADI Support Page

Ask the ADI community for help.

Ask the EngineerZone Community

FAQs

Sales & Ordering FAQs

Part Models 6

1ku List Price

price unavailable

Features

P1dB output power: ±27 dBm, ±28 dBm
Gain: 11 dB, 12.8 dB
Output IP3: +37 dBm
Supply voltage: +12 V at 300 mA

50 Ω matched input/output
Die size: 3.12 × 1.50 × 0.1 mm
32-lead, 5 × 5 mm, surface-mount technology (SMT) package

Additional Details

The HMC619 devices are GaAs, monolithic microwave integrated circuit (MMIC), and PHEMT distributed power amplifier die which operate between dc and 10 GHz. These amplifiers provide 11 dB or 12.8 dB of gain, ±37 dBm output IP3, and 27 dBm or 28 dBm of output power at 1 dB gain compression, while requiring 300 mA from a +12 V supply. Gain flatness is excellent at ±0.4 dB or ±0.5 dB from dc to 10GHz, making the HMC619 devices ideal for EW, ECM, radar, and test equipment applications. The HMC619 devices inputs/outputs are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All chip data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of minimal 0.31 mm (12 mils) length.

Applications

Telecom infrastructure
Microwave radio and VSAT
Military and space
Test instrumentation
Fiber optics

View All Documentation

Ask a Question

Submit your question below and we will return the best answer from ADI’s knowledge database:

Other places you can find help

Support

Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

Visit the ADI Support Page

Ask the ADI community for help.

Ask the EngineerZone Community

FAQs

Sales & Ordering FAQs

Part Models 6

1ku List Price

price unavailable

Technical Documents 2

HMC619LP5 Data Sheet 04/13/2015

HMC619 Die Data Sheet 09/11/2015

Reference Materials 4

Semiconductor Qualification Test Report: MESFET-B (QTR: 2013-00245) 04/22/2015

Package/Assembly Qualification Test Report: 32L 5x5mm QFN Package (QTR: 10009 REV: 05) 01/01/0001

Package/Assembly Qualification Test Report: LP5 & LP5G (QTR: 2014-00150 REV: 02) 10/29/2015

5 x 5 mm QFN Tape Specification (LP5, LC5, LH5) 10/28/2015

Design Resources 6

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC619	CHIPS OR DIE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC619-SX	CHIPS OR DIE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC619LP5	LFCSP:LEADFRM CHIP SCALE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC619LP5E	32-Lead QFN (5mm x 5mm w/ EP)	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC619LP5ETR	32-Lead QFN (5mm x 5mm w/ EP)	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
HMC619LP5TR	LFCSP:LEADFRM CHIP SCALE	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys