Features and Benefits
- Output power for 1 dB compression (P1dB): 17.5 dB typical
- Saturated output power (PSAT): 21 dBm typical
- Gain: 11 dB typical
- Output third-order intercept (IP3): 28 dBm typical
- Supply voltage: 5 V at 65 mA
- 50 Ω matched input/output
- Die size: 2.3 mm × 1.45 mm × 0.05 mm
The HMC1126 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transfer (pHEMT), monolithic microwave integrated circuit (MMIC), distributed power amplifier that operates from 2 GHz to 50 GHz. The HMC1126 provides 11 dB of gain, 28 dBm output IP3, and 17.5 dBm of output power at 1 dB gain compression, while requiring 65 mA from a 5 V supply.
The HMC1126 amplifier inputs/outputs are internally matched to 50 Ω facilitating integration into multichip modules (MCMs). All data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).
- Test instrumentation
- Microwave radios and VSATs
- Military and space
- Telecommunications infrastructure
- Fiber optics
Markets and Technologies
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Evaluation Kits (1)
The HMC1126-EVALZ is a 4-layer printed circuit board (PCB). The substrate between the top layer and the first internal layer is 12 mils thick and is made from Rogers 4003C. The internal and bottom side layers are all ground planes.
The RFIN and RFOUT ports on the HMC1126-EVALZ are populated with 1.85 mm, female coaxial connectors, and the respective RF traces have a 50 Ω characteristic impedance. The HMC1126-EVALZ is populated with components suitable for use over the entire −40°C to +85°C operating temperature range of the HMC1126ACEZ.
To calibrate out board trace losses, a through calibration path, CAL, is provided between the CAL1 and CAL2 connectors. CAL1 and CAL2 must be populated with 1.85 mm, female coaxial connectors (see Table 2 in th user guide for the part number). The power and bias voltages are the applied surface-mount technology (SMT) test points VDD, VGG1, and VGG2. Because there is no ground pin on the HMC1126-EVALZ, connect the ground cable by attaching a clip lead to one of the RF connector edges or to one of the available holes in the PCB.
The RF traces are 50 Ω, grounded, coplanar waveguide. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias connect the ground planes with particular focus on the area directly beneath the ground pad.
For full details on the HMC1126ACEZ, see the HMC1126ACEZ data sheet, which must be consulted in conjunction with the user guide when using the HMC1126-EVALZ.
Tools & Simulations
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Product Selection Guide (1)
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
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