REF02
不推荐用于新设计+5 V精密基准电压源/温度传感器
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产品详情
- 高输出精度：
5.0 V、±0.3% （最大值） - 可调输出：± 3%（最小值）
- 出色的温度稳定性：
8.5 ppm/°C（最大值） - 低噪声：15 µV峰峰值（典型值）
- 高电源电压范围：
最高36 V（最大值） - 低电源电流：1.4 mA（最大值）
- 高负载驱动能力：
10 mA（最大值） - 温度输出功能
REF0x系列精密基准电压源提供稳定的10.0 V、5.0 V或2.5 V输出，电源电压、环境温度或负载条件的变化对输出电压的影响极小。该器件采用8引脚SOIC、PDIP、CERDIP和TO-99封装，以及20引脚LCC封装（仅883），使得标准和高应力应用都可采用本器件。
利用外部缓冲和简单的电阻网络，可将TEMP引脚用于温度检测和估算。器件还提供TRIM引脚，用于精密调整输出电压。
REF0x系列基准电压源具有小尺寸、宽电源电压范围，应用广泛，非常适合通用型和空间受限的应用。
新设计应当使用ADR0x系列基准电压源，能够在更宽的工作温度范围内提供更高的精度和温度稳定性，并且保持与REF0x系列引脚完全兼容。该数据手册仅适用于商用级产品。若需军用级(883)数据手册，请联系销售部门或访问analog.com。
应用参考资料
数据手册 2
可靠性数据 1
应用笔记 1
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| 85514012A | 20-Lead LCC | ||
| 8551401PA | 8-Lead CerDIP | ||
| REF02AJ/883C | 8-Pin TO-99 | ||
| REF02AZ | 8-Lead CerDIP | ||
| REF02AZ/883C | 8-Lead CerDIP | ||
| REF02CESA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CESA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02CPZ | 8-Lead PDIP | ||
| REF02CSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSZ | 8-Lead SOIC | ||
| REF02CSZ-REEL | 8-Lead SOIC | ||
| REF02CSZ-REEL7 | 8-Lead SOIC | ||
| REF02EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02EZ | 8-Lead CerDIP | ||
| REF02HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02HPZ | 8-Lead PDIP | ||
| REF02HSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSZ | 8-Lead SOIC | ||
| REF02HZ | 8-Lead CerDIP | ||
| REF02NBC-002C | CHIPS OR DIE | ||
| REF02RC/883C | 20-Lead LCC | ||
| REF02Z | 8-Lead CerDIP |
| 产品型号 | 产品生命周期 | PCN |
|---|---|---|
| 未找到匹配项目 | ||
|
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
9月 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02CPZ | ||
| REF02CSZ-REEL | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02NBC-002C | ||
| REF02RC/883C | ||
| REF02Z | ||
|
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02EZ | ||
| REF02HZ | ||
| REF02RC/883C | ||
| REF02Z | ||
|
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02CPZ | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HZ | ||
| REF02RC/883C | ||
| REF02Z | ||
|
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
| 85514012A | ||
| REF02AJ/883C | ||
| REF02RC/883C | ||
|
7月 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| 85514012A | ||
| 8551401PA | ||
| REF02AJ/883C | ||
| REF02AZ/883C | 量产 | |
| REF02RC/883C | ||
|
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 8551401PA | ||
| REF02AZ | ||
| REF02AZ/883C | 量产 | |
| REF02EZ | ||
| REF02HZ | ||
| REF02Z | ||
|
10月 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
| REF02AZ | ||
| REF02CPZ | ||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02Z | ||
|
3月 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
| REF02AZ | ||
| REF02CPZ | ||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02EZ | ||
| REF02HPZ | ||
| REF02HSZ | ||
| REF02HZ | ||
| REF02Z | ||
|
10月 30, 2020 - 1702R2 ASSEMBLY |
||
| REF02CESA+ | 量产 | |
| REF02CESA+T | 量产 | |
|
2月 6, 2015 - 1373A WAFER FAB |
||
| REF02CESA+ | 量产 | |
| REF02CP+ | 最后购买期限 | |
| REF02CSA+ | 量产 | |
| REF02CSA+T | 量产 | |
| REF02EP+ | 最后购买期限 | |
| REF02HP+ | 最后购买期限 | |
| REF02HSA+ | 量产 | |
| REF02HSA+T | 量产 | |
|
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| REF02CPZ | ||
| REF02HPZ | ||
|
5月 22, 2018 - 1702N ASSEMBLY |
||
| REF02CSA+ | 量产 | |
| REF02CSA+T | 量产 | |
| REF02HSA+ | 量产 | |
| REF02HSA+T | 量产 | |
|
11月 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
||
| REF02CSZ | 量产 | |
| REF02CSZ-REEL | ||
| REF02CSZ-REEL7 | ||
| REF02HSZ | ||
这是最新版本的数据手册
硬件生态系统
| 部分模型 | 产品周期 | 描述 |
|---|---|---|
| ADR02 | 量产 | 超紧凑精密 5.0 V 基准电压源 |