OP227S

PRODUCTION

Aerospace Dual Low Noise Low Offset Inst. Op Amp

Data Sheet (Rev. I) Product Selection Table

Part Models: 2
1ku List Price: Starting From $342.57

Viewing:

Part Details

Excellent Individual Amplifier Parameters
Low VOS: 80 µV Max
Offset Voltage Match: 1µV/°C Max
Offset Voltage Match vs. Temperature: 1µV/°C Max

Stable VOS vs. Time: 1µV/Mo Max
Fast: 2.8V/µs Typ
High Fain: 1.8 Million Typ
High Channel Separation: 154dB Typ

Part Models: 2
1ku List Price: Starting From $342.57

Documentation

Data Sheet 1

OP227S: Dual, Low-Offset, Low Noise Operational Amplifier Aerospace Data Sheet (Rev.I) 05/13/2008

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
OP227R903M	CERPAK(HERM CER SRF MOUNT)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP227R903Y	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
OP227R903M	PRODUCTION
OP227R903Y	PRODUCTION
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
OP227R903Y	PRODUCTION	08_0073AQualPlan Material_Report PCN08_0073_Form

This is the most up-to-date revision of the Data Sheet.

Software Resources

Can't find the software or driver you need?

Request a Driver/Software

Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

OP227

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Latest Discussions

No discussions on OP227S yet. Have something to say?

Start a Discussion on EngineerZone®