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  4. MAX9700

Data Sheet Rev. 3
CN Rev. 3 | JP Rev. 3

Overview

Features and Benefits

  • Filterless Amplifier Passes FCC Radiated Emissions Standards with 100mm of Cable
  • Unique Spread-Spectrum Mode Offers 5dB Emissions Improvement Over Conventional Methods
  • Optional External SYNC Input
  • Simple Master-Slave Setup for Stereo Operation
  • 94% Efficiency
  • 1.2W into 8Ω
  • Low 0.01% THD+N
  • High PSRR (72dB at 217Hz)
  • Integrated Click-and-Pop Suppression
  • Low Quiescent Current (4mA)
  • Low-Power Shutdown Mode (0.1µA)
  • Short-Circuit and Thermal-Overload Protection
  • Available in Thermally Efficient, Space-Saving Packages
    • 10-Pin TDFN (3mm x 3mm x 0.8mm)
    • 10-Pin µMAX
    • 12-Bump UCSP (1.5mm x 2mm x 0.6mm)

Product Details

The MAX9700 mono class D audio power amplifier provides class AB amplifier performance with class D efficiency, conserving board space and extending battery life. Using a class D architecture, the MAX9700 delivers 1.2W into an 8Ω load while offering efficiencies above 90%. A low-EMI modulation scheme renders the traditional class D output filter unnecessary.

The MAX9700 offers two modulation schemes: a fixed-frequency (FFM) mode, and a spread-spectrum mode that reduces EMI-radiated emissions due to the modulation frequency. Furthermore, the MAX9700 oscillator can be synchronized to an external clock through the SYNC input, allowing the switching frequency to be user defined. The SYNC input also allows multiple MAX9700s to be cascaded and frequency locked, minimizing interference due to clock intermodulation. The device utilizes a fully differential architecture, a full-bridged output, and full-bridged comprehensive click-and-pop suppression. The gain of the MAX9700 is set internally (MAX9700A: 6dB, MAX9700B: 12dB, MAX9700C: 15.6dB, MAX9700D: 20dB), further reducing external component count.

The MAX9700 features high 72dB PSRR, a low 0.01% THD+N, and SNR in excess of 90dB. Short-circuit and thermal-overload protection prevent the device from damage during a fault condition. The MAX9700 is available in 10-pin TDFN (3mm x 3mm x 0.8mm), 10-pin µMAX® and 12-bump UCSP™ (1.5mm x 2mm x 0.6mm) packages. The MAX9700 is specified over the extended -40°C to +85°C temperature range.

Applications

  • Cell Phones
  • MP3 Players
  • PDAs
  • Portable Audio

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At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

Documentation & Resources

  • View All (6)
  • Data Sheets (1)
  • Reliability Data (1)
  • Design Notes (1)
  • Technical Articles (3)
    • Document Type

    Product Recommendations

    MAX9700 Companion Parts

    Recommended Related Parts

    Design Resources

    ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

    Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
    MAX9700AEUB+ Material Declaration Reliability Data 10-MINI_SO-N/A
    MAX9700AEUB+T Material Declaration Reliability Data 10-MINI_SO-N/A
    MAX9700BEBC+ Material Declaration Reliability Data 12-WLCSP-N/A
    MAX9700BEBC+T Material Declaration Reliability Data 12-WLCSP-N/A
    MAX9700BETB+ Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700BETB+T Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700BEUB+ Material Declaration Reliability Data 10-MINI_SO-N/A
    MAX9700BEUB+T Material Declaration Reliability Data 10-MINI_SO-N/A
    MAX9700CETB+ Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700CETB+T Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700DEBC+ Material Declaration Reliability Data 12-WLCSP-N/A
    MAX9700DEBC+T Material Declaration Reliability Data 12-WLCSP-N/A
    MAX9700DETB+ Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700DETB+T Material Declaration Reliability Data Thin Dual Flatpack No Leads, Exposed Pad
    MAX9700DEUB+ Material Declaration Reliability Data 10-MINI_SO-N/A
    MAX9700DEUB+T Material Declaration Reliability Data 10-MINI_SO-N/A
    Wafer Fabrication Data MAX9700 Reliability Data

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    • MAX9700AEUB+ Production
    • MAX9700AEUB+T Production
    • MAX9700BEUB+ Production
    • MAX9700BEUB+T Production
    • MAX9700DEUB+ Production
    • MAX9700DEUB+T Production

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