MAX77812
PRODUCTION20A User-Configurable Quad-Phase Buck Converter
High-Efficiency 20A BUCK with User-Selectable Phase Configuration
- Part Models
- 12
- 1ku List Price
- Starting From $2.97
Overview
- 20A Maximum Output Current (5A per Phase)
- VIN Range: 2.5V to 5.5V
- VOUT Range: 0.250V to 1.525V with 5mV Steps
- ±0.5% Initial Output Accuracy with Differential Sensing
- 5 User-Selectable Phase Configurations
- 91% Peak Efficiency (VIN = 3.8V, VOUT = 1.1V)
- Auto (SKIP/PWM) and Forced PWM Modes
- Enhanced Load Transient Response
- Programmable Ramp-Up/Down Slew Rates
- Programmable Startup/Shutdown Sequence
- UVLO, Short-Circuit, and Thermal Protections
- 2 User-Programmable General-Purpose Inputs
- 3.4MHz High Speed I2C and 30MHz SPI Interface
- 3.408mm x 3.368mm, 64-Bump WLP Package
The MAX77812 is a quad-phase high-efficiency stepdown (buck) converter capable of delivering up to 20A of maximum current. Programmable startup/shutdown sequence and user-selectable phase configurations make the MAX77812 ideal for powering the latest generations of processors. With high-efficiency and small solution size, the MAX77812 is optimized for space constrained single-cell battery powered applications.
The MAX77812 uses an adaptive on-time PWM control scheme and it has SKIP and low-power SKIP modes for improved light-load efficiency. A programmable current limit reduces the overall solution footprint by optimizing inductors size. Differential sensing provides high output voltage accuracy, while enhanced transient response (ETR) allows fast output voltage adjustments to load transients. Programmable soft-start/stop and ramp-up/down slew rate provides control over an inrush current as the regulator transitions between operating states.
A 3.4MHz high-speed I2C or 30MHz SPI interface with dedicated logic inputs provide full configurability and control for system power optimization.
The MAX77812 is available in 3.408mm x 3.368mm, 64-bump 0.4mm pitch wafer-level package (WLP).
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Applications
- AR/VR Headsets and Game Consoles
- CPU/GPU, FPGAs, and DSPs Power Supply
- Li-ion Battery Powered Equipment
- Space Constrained Portable Electronics
Documentation
Data Sheet 1
User Guide 1
Design Note 8
Technical Articles 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX77812AEWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812AEWB+T | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812BEWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812BEWB+T | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812CEWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812CEWB+T | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812DEWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812DEWB+T | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812EWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812EWB+T | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812FEWB+ | Wafer-Level Package 8x8 Bump, Full Array | ||
| MAX77812FEWB+T | Wafer-Level Package 8x8 Bump, Full Array |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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ADI Power Studio™ Designer
ADI Power Studio™ Designer is the next-generation tool for IC-level, power supply design, guiding engineers to faster, validated solutions.
Learn MoreSoftware Development 1
SIMPLIS Models 1
Evaluation Kits
Evaluation Kit for the MAX77812
Resources
Reference Designs
Scalable, Single Input, 6 Output, Power Solution for the Versal ACAP Platform