1. Products
  2. Power Management
  3. Switching Regulators
  4. Step-Down (Buck) Regulators
  5. Internal Power Switch Buck Regulators
  6. MAX77812


Overview

Features and Benefits

  • 20A Maximum Output Current (5A per Phase)
  • VIN Range: 2.5V to 5.5V
  • VOUT Range: 0.250V to 1.525V with 5mV Steps
  • ±0.5% Initial Output Accuracy with Differential Sensing
  • 5 User-Selectable Phase Configurations
  • 91% Peak Efficiency (VIN = 3.8V, VOUT = 1.1V)
  • Auto (SKIP/PWM) and Forced PWM Modes
  • Enhanced Load Transient Response
  • Programmable Ramp-Up/Down Slew Rates
  • Programmable Startup/Shutdown Sequence
  • UVLO, Short-Circuit, and Thermal Protections
  • 2 User-Programmable General-Purpose Inputs
  • 3.4MHz High Speed I2C and 30MHz SPI Interface
  • 3.408mm x 3.368mm, 64-Bump WLP Package

Product Details

The MAX77812 is a quad-phase high-efficiency stepdown (buck) converter capable of delivering up to 20A of maximum current. Programmable startup/shutdown sequence and user-selectable phase configurations make the MAX77812 ideal for powering the latest generations of processors. With high-efficiency and small solution size, the MAX77812 is optimized for space constrained single-cell battery powered applications.

The MAX77812 uses an adaptive on-time PWM control scheme and it has SKIP and low-power SKIP modes for improved light-load efficiency. A programmable current limit reduces the overall solution footprint by optimizing inductors size. Differential sensing provides high output voltage accuracy, while enhanced transient response (ETR) allows fast output voltage adjustments to load transients. Programmable soft-start/stop and ramp-up/down slew rate provides control over an inrush current as the regulator transitions between operating states.

A 3.4MHz high-speed I2C or 30MHz SPI interface with dedicated logic inputs provide full configurability and control for system power optimization.

The MAX77812 is available in 3.408mm x 3.368mm, 64-bump 0.4mm pitch wafer-level package (WLP).

Design Solution: How to Power Your QSFP-DD Optical Transceiver ›

Design Solution: How to Make Your Portable Game Console Play Longer ›

Applications

  • AR/VR Headsets and Game Consoles
  • CPU/GPU, FPGAs, and DSPs Power Supply
  • Li-ion Battery Powered Equipment
  • Space Constrained Portable Electronics

Product Lifecycle icon-recommended Production

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

Evaluation Kits (1)

Tools & Simulations

EE-Sim® Power Tools

The EE-Sim DC-DC Converter Tool uses your requirements to quickly create a complete power design including a schematic, BOM with commercially available parts, and time and frequency domain simulations. Your customized schematic can be downloaded for further analysis in the standalone EE-Sim OASIS Simulator, featuring SIMPLIS and SIMetrix SPICE engines.

EESim-Pdp-Spotlight

SIMPLIS Models

MAX77812 SIMPLIS Schematic

MAX77812 SIMPLIS Schematic

Software Development

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
MAX77812AEWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812AEWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812BEWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812BEWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812CEWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812CEWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812DEWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812DEWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812EWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812EWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812FEWB+ Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
MAX77812FEWB+T Material Declaration Reliability Data Wafer-Level Package 8x8 Bump, Full Array
Wafer Fabrication Data MAX77812 Reliability Data

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Sample & Buy


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Evaluation Boards

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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.