Overview
Features and Benefits
- Accuracy
- ±1°C (max) from 0°C ≤ TRJ ≤ +125°C, TA = +30°C
- ±2.4°C (max) from -55°C ≤ TRJ ≤ +100°C,
- 0°C ≤ TA ≤ +70°C
- 12-Bit + Sign, 0.0625°C Resolution
- Low Power Consumption
- 30µA (typ) (MAX6628)
- 200µA (typ) (MAX6627)
- Operating Temperature Range (-55°C to +125°C)
- Measurement Temperature Range, Remote Junction (-55°C to +145°C)
- 0.5s (MAX6627) or 8s (MAX6628) Conversion Rate
- SPI-Compatible Interface
- +3.0V to +5.5V Supply Range
- 8-Pin SOT23 and TDFN Packages
- Lead-Free Version Available (TDFN Package)
Product Details
The MAX6627/MAX6628 precise digital temperature sensors report the temperature of a remote sensor. The remote sensor is a diode-connected transistor, typically a low-cost, easily mounted 2N3904 NPN type that replaces conventional thermistors or thermocouples. The MAX6627/MAX6628 can also measure the die temperature of other ICs, such as microprocessors (µPs) or microcontrollers (µCs) that contain an on-chip, diode-connected transistor.
Remote accuracy is ±1°C when the temperature of the remote diode is between 0°C and +125°C and the temperature of the MAX6627/MAX6628 is +30°C. The temperature is converted to a 12-bit + sign word with 0.0625°C resolution. The architecture of the device is capable of interpreting data as high as +145°C from the remote sensor. The MAX6627/MAX6628 temperature should never exceed +125°C.
These sensors are 3-wire serial interface SPI-compatible, allowing the MAX6627/MAX6628 to be readily connected to a variety of µCs. The MAX6627/MAX6628 are read-only devices, simplifying their use in systems where only temperature data is required.
Two conversion rates are available, one that continuously converts data every 0.5s (MAX6627), and one that converts data every 8s (MAX6628). The slower version provides minimal power consumption under all operating conditions (30µA, typ). Either device can be read at any time and provide the data from the last conversion.
Both devices operate with supply voltages between +3.0V and +5.5V, are specified between -55°C and +125°C, and come in space-saving 8-pin SOT23 and lead-free TDFN packages.
Applications
- Hard Disk Drive
- Industrial Control Systems
- Notebooks, PCs
- Smart Battery Packs/Chargers
Product Categories
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Product Recommendations
MAX6627 Companion Parts
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
---|---|---|---|---|
MAX6627MKA+ | Material Declaration | Reliability Data | 8-SOT_23-N/A | |
MAX6627MKA+T | Material Declaration | Reliability Data | 8-SOT_23-N/A | |
MAX6627MTA+ | Material Declaration | Reliability Data | Thin Dual Flatpack No Leads, Exposed Pad | |
MAX6627MTA+T | Material Declaration | Reliability Data | Thin Dual Flatpack No Leads, Exposed Pad | |
Wafer Fabrication Data | MAX6627 Reliability Data |
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