Data Sheet Rev. 0

Overview

Features and Benefits

  • Allows Wide Range of Applications by Supporting Universal 3.5mm Jack Types
    • Auto-Configuration for CTIA and OMTP Headsets
    • Supports MEMS Microphone
    • 50mΩ Ground Switch
  • Enables Long Utilization of Accessories by Supplying Power Through 3.5mm Jack
    • Powered Accessory/Headset Detection
    • Bypass Switch to Power Accessories, Such as ANC Headsets
    • Programmable Button Detection in Powered Accessory Mode
  • Empowers New Path in Data Communication to Accessories
    • Power Line Communication by 3.5mm Jack
    • Bidirectional Digital Data Communication in Power Mode
    • Allow Emergence of New Accessory Types
  • Provides Comfortable Sounds by Introducing Automatic Volume Adjustment
    • Adaptive Volume Control Based on Precision Headset Impedance
    • False Insertion Detection
  • Saves Board Space with Small Form Factor
    • 1.65mm x 2.05mm 4 x 5 Array 20-Bump 0.4mm Pitch WLP

Product Details

The MAX20317 is an I2C controllable, universal 3.5mmØ accessory management IC. The device provides a universal jack interface solution, as well as a compact solution for the power management and interface control of a powered accessory, such as an active noise cancelling (ANC) headset.

The MAX20317 automatically measures headset impedance with a high precision, triple current source 8 bit ADC. After impedance detection, the device also detects when a headset is in a CTIA or OMTP configuration and automatically configures the SLEEVE and RING2 terminals to correctly connect the microphone and ground lines.

When a boost supply is applied, the MAX20317 can detect the presence of an ANC headset. When the ANC headset is detected and enabled, a button-press monitoring circuit activates and flags button presses by detecting the voltage drop across a sense resistor.

The MAX20317 provides a power line communication tool to a headset to exchange the data with the host device.

The MAX20317 has the two separate ground sense inputs from the SLEEVE and RING2 terminals of the connector to provide a high ground isolation to the audio codec.

The MAX20317 is available in a space-saving, 20-bump, 0.4mm pitch, 1.65mm x 2.05mm wafer-level package (WLP) and operates over the -40°C to +85°C extended temperature range.

Applications

  • Notebook PCs
  • Phablet
  • Smart Phones
  • Tablet PCs

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