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Features
- 80µA Supply Current
- 4V to 36V Operation
- 0.5°C Initial Accuracy (A Version)
- Compatible with Standard Thermocouples (E, J, K, R, S, T)
- Auxiliary 10mV/°C Output
- Available in 8-Lead PDIP and SO Packages
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The LT1025 is a micropower thermocouple cold junction compensator for use with type E, J, K, R, S, and T thermocouples. It utilizes wafer level and post-package trimming to achieve 0.5°C initial accuracy. Special curvature correction circuitry is used to match the "bow" found in all thermocouples so that accurate cold junction compensation is maintained over a wider temperature range.
The LT1025 will operate with a supply voltage from 4V to 36V. Typical supply current is 80µA, resulting in less than 0.1°C internal temperature rise for supply voltages under 10V. A 10mV/°C output is available at low impedance, in addition to the direct thermocouple voltages of 60.9µV/°C (E), 51.7µV/°C (J), 40.3µV/°C (K, T) and 5.95µV/°C (R, S). All outputs are essentially independent of power supply voltage.
A special kit is available (LTK001) which contains an LT1025 and a custom tailored thermocouple amplifier. The amplifier and compensator are matched to allow a much tighter specification of temperature error than would be obtained by adding the compensator and amplifier errors on a worst-case basis. The amplifier from this kit is available separately as LTKA0x.
The LT1025 is available in either an 8-pin PDIP or 8-pin SO package for temperatures between 0°C and 70°C.
Applications
- Thermocouple Cold Junction Compensator
- Centigrade Thermometer
- Temperature Compensation Network
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LT1025
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Documentation
Data Sheet 1
Reliability Data 1
Application Note 5
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| LT1025ACN8#PBF |
8-Lead PDIP (Narrow 0.3 Inch)
|
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| LT1025CN8#PBF |
8-Lead PDIP (Narrow 0.3 Inch)
|
|
|
| LT1025CS8#PBF |
8-Lead SOIC (Narrow 0.15 Inch)
|
|
|
| LT1025CS8#TRPBF |
8-Lead SOIC (Narrow 0.15 Inch)
|
|
- LT1025ACN8#PBF
- Pin/Package Drawing
-
8-Lead PDIP (Narrow 0.3 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- LT1025CN8#PBF
- Pin/Package Drawing
-
8-Lead PDIP (Narrow 0.3 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- LT1025CS8#PBF
- Pin/Package Drawing
-
8-Lead SOIC (Narrow 0.15 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- LT1025CS8#TRPBF
- Pin/Package Drawing
-
8-Lead SOIC (Narrow 0.15 Inch)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 8, 2024
- 24_0234
Migrating Bottom Trace Code Marking to Top Side Laser Marking for PDIP Package
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Oct 11, 2022
- 22_0241
Epoxy Change from Henkel 8290 to 8290A for PDIP Package
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Aug 6, 2022
- 22_0172
Laser Top Mark Conversion for PDIP Packages Assembled in ADPG [PNG]
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Oct 8, 2024
- 24_0236
Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
Oct 12, 2022
- 22_0254
Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2)
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
Jun 11, 2021
- 21_0060
Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 8, 2024
- 24_0234
Migrating Bottom Trace Code Marking to Top Side Laser Marking for PDIP Package
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Oct 11, 2022
- 22_0241
Epoxy Change from Henkel 8290 to 8290A for PDIP Package
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Aug 6, 2022
- 22_0172
Laser Top Mark Conversion for PDIP Packages Assembled in ADPG [PNG]
LT1025ACN8#PBF
PRODUCTION
LT1025CN8#PBF
PRODUCTION
Oct 8, 2024
- 24_0236
Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
Oct 12, 2022
- 22_0254
Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2)
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
Jun 11, 2021
- 21_0060
Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM
LT1025CS8#PBF
PRODUCTION
LT1025CS8#TRPBF
PRODUCTION
