HMC860 Data Sheet4/22/2015
Features and Benefits
- Ultra Low Noise:
3nV/√Hz at 10 kHz, 7nV/√Hz at 1 kHz
- Four Voltage Outputs:
VR1 @ 3V / 80 mA
VR2, VR3 @ 3V / 20 mA
VR4 @ 4.5V / 120 mA
- High Power Supply Rejection Ratio (PSRR)
80 dB at 1 kHz, 60 dB at 1 MHz
- Adjustable Outputs: 2.5V to 5.2V
- Low Power-Down Current: <1 μA
- 16 Lead 3 × 3mm SMT Package: 9mm2
The HMC860LP3E is a BiCMOS ultra low noise quad-output voltage regulator. It features a low noise band-gap reference externally decoupled for best in-close noise performance. High Power Supply Rejection Ratio (PSRR) in the 0.1 MHz to 10 MHz range provides excellent rejection of preceding switching regulator noise. The four voltage outputs are ideal for frequency generation subsystems including Hittite's broad line of PLLs with Integrated VCOs. Each output voltage can be adjusted higher or lower than the default value by using one external resistor.
Each output can be set to 5V by grounding the corresponding HV pin. The regulator can be powered down by the TTL-compatible Enable input. The HMC860LP3E is housed in a 3 × 3mm QFN SMT package.
- Test Instrumentation
- Military Radios, Radar and ECM
- Basestation Infrastructure
- Ultra Low Noise Frequency Generation
- Fractional-N Synthesizer Supply
- Mixed-Signal Circuit Supply
Product Lifecycle Last Time Buy
All products in this family will be obsolete soon. Please contact ADI Sales or Distributors to arrange for final purchases and read our Obsolescence Information to review the time periods for placing final orders and receiving final shipments.
Evaluation Kits (1)
This page contains ordering information for evaluating the HMC860LP3E.
The Design Files link includes the BOM, schematics, and Gerber files for the evaluation board.
Documentation & Resources
Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR: 11003 REV: 02)5/3/2019
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR: 05006 REV: 02)4/25/2017
Semiconductor Qualification Test Report: BiCMOS-A (QTR: 2013-00235)10/29/2015
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G (QTR: 2014-0364)10/29/2015
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC860LP3E||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|HMC860LP3ETR||Material Declaration||Reliability Data||16-Lead QFN (3mm x 3mm w/ EP)|
|Wafer Fabrication Data|
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