Overview
Features and Benefits
- Gain: 21 dB typical
- Noise figure: 3.6 dB typical
- Output power for 1 dB compression: 13 dBm typical
- Input third-order intercept at maximum gain: 1 dBm typical
- Output third-order intercept at maximum gain: 22 dBm typical
- Saturated output power: 17 dBm typical
- Input return loss: 15 dB typical
- Output return loss: 17 dB typical
- Die size: 2.844 mm × 0.999 mm × 0.05 mm
Product Details
The HMC8325 is an integrated E-band gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), low noise amplifier (LNA) chip that operates from 71 GHz to 86 GHz. The HMC8325 provides 21 dB of gain, 13 dBm of output P1dB, 22 dBm of OIP3, and 17 dBm of PSAT while requiring only 50 mA from a 3 V power supply. The HMC8325 exhibits excellent linearity and is optimized for E-band communications and high capacity, wireless backhaul radio systems. All data is taken with the chip in a 50 Ω test fixture connected via a 3 mil wide × 0.5 mil thick × 7 mil long ribbon on each port.
Applications
- E-band communication systems
- High capacity wireless backhauls
- Test and measurement
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
Sys-Parameters
Sys-Parameter Models for Keysight Genesys
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
Design Tools
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC8325 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC8325-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
Sample & Buy
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Buy Now Pricing
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List Pricing
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Lead Times
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Sampling
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