Overview
Features and Benefits
- Conversion loss: 10 dB typical
- Sideband rejection: 22 dBc typical Input power for 1 dB compression (P1dB): 16 dBm typical
- Input third-order intercept (IP3): 24 dBm typical
- Input second-order intercept (IP2): −5 dBm typical
- 6× local oscillator (LO) leakage at RFOUT: −23 dBm typical
- RF return loss: 12 dB typical
- LO return loss: 20 dB typical
- Die size: 3.601 mm × 1.609 mm × 0.05 mm
Product Details
The HMC8119 is an integrated E-band gallium arsenide (GaAs) pseudomorphic (pHEMT) monolithic microwave integrated circuit (MMIC), in-phase/quadrature (I/Q) upconverter chip that operates from 81 GHz to 86 GHz. The HMC8119 provides a small signal conversion loss of 10 dB with 22 dBc of sideband rejection across the frequency band. The device uses an image rejection mixer that is driven by a 6× LO multiplier. Differential I and Q mixer inputs are provided. The inputs can be driven with differential I and Q baseband waveforms for direct conversion applications. Alternatively, the inputs can be driven using an external 90° hybrid and two external 180° hybrids for single-sideband applications. All data includes the effect of a 1 mil gold wire wedge bond on the intermediate frequency (IF) ports.
Applications
- E-band communication systems
- High capacity wireless backhaul
- Test and measurement
Product Categories
Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
Design Tools
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC8119 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC8119-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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HMC8119 Discussions
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