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HMC7587: 81 GHz to 86 GHz E-Band I/Q Downconverter Data Sheet (Rev. A)3/2/2016PDF944 K
Overview
Features and Benefits
- Conversion gain: 10 dB typical
- Image rejection: 30 dBc typical
- Noise figure: 6 dB typical
- Input power for 1 dB compression (P1dB): −10 dBm typical
- Input third-order intercept (IP3): −2 dBm typical
- Input second-order intercept (IP2): 25 dBm typical
- 6× LO leakage at RFIN: −40 dBm typical
- Radio frequency (RF) return loss: 10 dB typical
- Local oscillator (LO) return loss: 20 dB typical
- Die size: 3.599 mm × 2.199 mm × 0.05 mm
Product Details
The HMC7587 is an integrated, E-band gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), in-phase/quadrature (I/Q) downconverter chip that operates from 81 GHz to 86 GHz. The HMC7587 provides a small signal con-version gain of 10 dB with 30 dBc of sideband rejection across the frequency band. The device uses a low noise amplifier followed by an image rejection mixer that is driven by a 6× multiplier.
The image rejection mixer eliminates the need for a filter following the low noise amplifier. Differential I and Q mixer outputs are provided for direct conversion applications. Alternatively, the outputs can be combined using an external 90° hybrid and two external 180° hybrids to allow for single-sideband applications. All data includes the effect of a 3 mm wide ribbon wedge bond on the RF port, and a 1 mm gold wire wedge bond on the intermediate frequency (IF) ports.
Applications
- E-band communication systems
- High capacity wireless backhauls
- Test and measurement
Product Categories
Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
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RF, Microwave, and Millimeter Wave Product Selection Guide7/13/2018PDF9M
Tools & Simulations
Design Tools
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Design Resources
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| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC7587 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC7587-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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HMC7587 Discussions
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