HMC7586

RECOMMENDED FOR NEW DESIGNS

71 GHz to 76 GHz, E-Band I/Q Downconverter

Data Sheet (Rev. A) Product Selection Table

Part Models: 2
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Overview

Conversion gain: 12.5 dB typical
Image rejection: 28 dBc typical
Noise figure: 5 dB typical
Input power for 1 dB compression (P1dB): −9 dBm typical
Input third-order intercept (IP3): −1 dBm typical
Input second-order intercept (IP2): 20 dBm typical
6× local oscillator (LO) leakage at RFIN: −40 dBm typical
1× LO leakage at IFOUT: −50 dBm typical
Radio frequency (RF) return loss: 5 dB typical
LO return loss: 20 dB typical
Die size: 3.599 mm × 2.199 mm × 0.05 mm

The HMC7586 is an integrated E-band gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) in phase/ quadrature (I/Q) downconverter chip that operates from 71 GHz to 76 GHz. The HMC7586 provides a small signal conversion gain of 12.5 dB with 28 dBc of image rejection across the frequency band. The device utilizes a low noise amplifier followed by an image rejection mixer that is driven by a 6× LO multiplier.

The image rejection mixer eliminates the need for a filter following the low noise amplifier. Differential I and Q mixer outputs are provided for direct conversion applications. Alternatively, the outputs can be combined using an external 90° hybrid and two external 180° hybrids for single-sideband applications. All data includes the effect of a 1 mil gold wire wedge bond on the IF ports.

Applications

E-band communication systems
High capacity wireless backhaul
Test and measurement

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC7586: 71 GHz to 76 GHz, E-Band I/Q Downconverter Data Sheet (Rev.A) 03/03/2016

Technical Articles 1

E-Band Wireless Radio Links Deliver High Capacity Backhaul Solutions for 5G Networks—Part 1 10/23/2023

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC7586	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC7586-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

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Tools & Simulations

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

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