Features and Benefits
- Conversion gain: 12.5 dB typical
- Image rejection: 28 dBc typical
- Noise figure: 5 dB typical
- Input power for 1 dB compression (P1dB): −9 dBm typical
- Input third-order intercept (IP3): −1 dBm typical
- Input second-order intercept (IP2): 20 dBm typical
- 6× local oscillator (LO) leakage at RFIN: −40 dBm typical
- 1× LO leakage at IFOUT: −50 dBm typical
- Radio frequency (RF) return loss: 5 dB typical
- LO return loss: 20 dB typical
- Die size: 3.599 mm × 2.199 mm × 0.05 mm
The HMC7586 is an integrated E-band gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) in phase/ quadrature (I/Q) downconverter chip that operates from 71 GHz to 76 GHz. The HMC7586 provides a small signal conversion gain of 12.5 dB with 28 dBc of image rejection across the frequency band. The device utilizes a low noise amplifier followed by an image rejection mixer that is driven by a 6× LO multiplier.
The image rejection mixer eliminates the need for a filter following the low noise amplifier. Differential I and Q mixer outputs are provided for direct conversion applications. Alternatively, the outputs can be combined using an external 90° hybrid and two external 180° hybrids for single-sideband applications. All data includes the effect of a 1 mil gold wire wedge bond on the IF ports.
- E-band communication systems
- High capacity wireless backhaul
- Test and measurement
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC7586||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC7586-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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