HMC570 Die Datasheet10/20/2015
Features and Benefits
- Conversion Gain: 10 dB
- Image Rejection: 17 dB
- 2 LO to RF Isolation: 35 dB
- Noise Figure: 3 dB
- Input IP3: +3 dBm
- Die Size: 2.33 × 2.73 x 0.10mm
The HMC570 is a compact GaAs MMIC I/Q downconverter chip which provides a small signal conversion gain of 10 dB with a noise figure of 3 dB and 17 dB of image rejection across the frequency band. The device utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency.
I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. All data shown below is taken with the chip mounted in a 50 Ohm test fixture and includes the effects of 1 mil diameter x 20 mil length bond wires on each port. This product is a much smaller alternative to hybrid style image reject mixer downconverter assemblies.
- Point-to-Multi-Point Radio
- Military Radar, EW & ELINT
- Satellite Communications
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Tools & Simulations
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC570||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC570-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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