HMC365-Die

PRODUCTION

InGaP HBT Divide-by-4 Chip, DC - 13 GHz

Part Models
2
1ku List Price
price unavailable
Viewing:

Part Details

  • Ultra Low SSB Phase Noise: -151 dBc/Hz
  • Wide Bandwidth
  • Output Power: 5 dBm
  • Single DC Supply: +5V
  • Small Size: 1.30 x 0.69 x 0.1 mm
HMC365-Die
InGaP HBT Divide-by-4 Chip, DC - 13 GHz
HMC365 Functional Block Diagram
Add to myAnalog

Add product to the Products section of myAnalog (to receive notifications), to an existing project or to a new project.

Create New Project
Ask a Question

Documentation

Data Sheet

This is the most up-to-date revision of the Data Sheet.

Learn More
Add to myAnalog

Add media to the Resources section of myAnalog, to an existing project or to a new project.

Create New Project

Software Resources

Can't find the software or driver you need?

Request a Driver/Software

Latest Discussions

No discussions on HMC365-DIE yet. Have something to say?

Start a Discussion on EngineerZone®

Recently Viewed