HMC363 Die Data Sheet4/14/2015
Features and Benefits
- Ultra Low SSB Phase Noise: -153 dBc/Hz
- Wide Bandwidth
- Output Power: -6 dBm
- Single DC Supply: +5V
- Small Size: 1.45 × 0.69 x 0.1 mm
The HMC363 is a low noise Divide-by-8 Static Divider with InGaP GaAs HBT technology that has a small size of 1.45 x 0.69 mm. This device operates from DC (with a square wave input) to 12 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -153 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance.
- Satellite Communication Systems
- Fiber Optic
- Point-to-Point Radios
- Point-to-Multi-Point Radios
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|HMC363||Material Declaration||Reliability Data||CHIPS OR DIE|
|HMC363-SX||Material Declaration||Reliability Data||CHIPS OR DIE|
|Wafer Fabrication Data|
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