HMC363-Die

PRODUCTION

InGaP HBT Divide-by-8 Chip, DC - 12 GHz

Part Models: 2
1ku List Price: price unavailable

Viewing:

Overview

Ultra Low SSB Phase Noise: -153 dBc/Hz
Wide Bandwidth
Output Power: -6 dBm

Single DC Supply: +5V
Small Size: 1.45 × 0.69 x 0.1 mm

The HMC363 is a low noise Divide-by-8 Static Divider with InGaP GaAs HBT technology that has a small size of 1.45 x 0.69 mm. This device operates from DC (with a square wave input) to 12 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -153 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance.

APPLICATIONS

Satellite Communication Systems
Fiber Optic
Point-to-Point Radios
Point-to-Multi-Point Radios
VSAT

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC363 Die Data Sheet 04/14/2015

Application Note 1

AN-1463: Frequency Divider Operation and Compensation with No Input Signal (Rev.A) 06/01/2017

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC363	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC363-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

Can't find the software or driver you need?

Request a Driver/Software

Latest Discussions

No discussions on HMC363-DIE yet. Have something to say?

Start a Discussion on EngineerZone®