HMC361-Die

PRODUCTION

InGaP HBT Divide-By-2 Chip, DC - 11 GHz

Data Sheet Product Selection Table

Part Models: 2
1ku List Price: price unavailable

Viewing:

Part Details

Ultra Low SSB Phase Noise:
-148 dBc/Hz
Wide Bandwidth
Output Power: 3 dBm

Single DC Supply: +5V
Small Size: 1.14 x 0.69 x 0.1 mm

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC361 Die Data Sheet 10/22/2015

Application Note 1

AN-1463: Frequency Divider Operation and Compensation with No Input Signal (Rev.A) 06/01/2017

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC361	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC361-SX	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

Can't find the software or driver you need?

Request a Driver/Software

Latest Discussions

No discussions on HMC361-DIE yet. Have something to say?

Start a Discussion on EngineerZone®