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HMC339 Data Sheet4/22/2015
Overview
Features and Benefits
- Integrated LO Amplifier: +2 dBm Input
- Sub-Harmonically Pumped (x2) LO
- High 2 LO/RF Isolation: > 37 dB
- Die Size: 1.32 x 0.81 0.1 mm
Product Details
The HMC339 chip is a sub-harmonically pumped (x2) MMIC mixer with an integrated LO amplifier which can be used as an upconverter or downconverter. The chip utilizes a GaAs PHEMT technology that results in a small overall chip area of 1.07mm². The 2LO to RF isolation is excellent eliminating the need for additional filtering. The LO amplifier is a single bias (+3V to +4V) two stage design with only +2 dBm nominal drive requirement. All data is measured with the chip in a 50 ohm test fixture connected via 0.025mm (3 mil) ribbon bonds of minimal length <0.31 mm (<12 mils).
APPLICATIONS
- 33 to 42 GHz Microwave Radios
- Up and Down Converter for Point-to-Point Radios
- Satellite Communication Systems
Product Categories
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
S-Parameters
ZIP
HMC339 S-Parameters
11.29 K
Design Tools
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC339 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC339-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
Support & Discussions
HMC339 Discussions
Sample & Buy
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Buy Now Pricing
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List Pricing
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Lead Times
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