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HMC311LP3

LAST TIME BUY

InGaP HBT Gain Block MMIC Amplifier, DC - 6 GHz

Data Sheet Product Selection Table

Part Models: 5
1ku List Price: price unavailable

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Overview

P1dB Output Power: +15.5 dBm
Output IP3: +32 dBm
Gain: 14.5 dB
50 Ω I/O’s
16 Lead 3 × 3 mm SMT Package: 9mm²

The HMC311LP3(E) is a GaAs InGaP Heterojunction Bipolar Transistor (HBT) Gain Block MMIC SMT DC to 6 GHz amplifiers. This 3 × 3mm QFN packaged amplifier can be used as either a cascadable 50 Ω gain stage or to drive the LO of HMC mixers with up to +17 dBm output power. The HMC311LP3(E) offers 14.5 dB of gain and an output IP3 of +32 dBm while requiring only 56 mA from a +5V supply. The Darlington feedback pair used results in reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components.

Applications

Cellular / PCS / 3G
Fixed Wireless & WLAN
CATV & Cable Modem
Microwave Radio

Part Models: 5
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC311LP3/HMC311LP3E: InGaP HBT Gain Block MMIC Amplifier, DC - 6 GHz Data Sheet 10/22/2015

Application Note 3

Thermal Management for Surface Mount Components General Application Note 11/11/2015

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages 08/01/2019

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC311LP3	16-Lead LFCSP (3mm x 3mm x 0.85mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC311LP3E	16-Lead LFCSP (3mm x 3mm x 0.85mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC311LP3ETR	16-Lead LFCSP (3mm x 3mm x 0.85mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC311LP3TR	16-Lead LFCSP (3mm x 3mm x 0.85mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC8430	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jun 19, 2017 - 17_0038 Obsolescence of Lead (Pb)-Bearing Packages
		PDN17_0038_Form Material_Report
HMC311LP3	Obsolete
HMC311LP3TR	Obsolete
Sep 29, 2025 - 25_0079 Obsolescence of GCS P1HBT Process
		PDN25_0079_Form Material_Report
HMC311LP3E	LAST TIME BUY
HMC311LP3ETR	LAST TIME BUY

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

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S-Parameter 1

HMC311LP3 S-Parameters

Sys-Parameter Models for Keysight Genesys

Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.

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