HMC263-Die

PRODUCTION

Low Noise Amplifier Chip, 24 - 36 GHz

Part Models: 2
1ku List Price: price unavailable

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Overview

Excellent Noise Figure: 2 dB
Gain: 22 dB
Single Supply: +3V @ 58 mA
Small Size: 2.48 x 1.33 x 0.1 mm

The HMC263 chip is a GaAs MMIC Low Noise Amplifier (LNA) which covers the frequency range of 24 to 36 GHz. The chip can easily be integrated into Multi-Chip Modules (MCMs) due to its small (3.29 mm²) size. The chip utilizes a GaAs PHEMT process offering 22 dB gain from a single bias supply of +3V @ 58 mA with a noise figure of 2 dB. All data is with the chip in a 50 ohm test fixture connected via 0.076 mm (3 mil) diameter ribbon bonds of minimal length 0.31 mm (<12 mils). The HMC263 may be used in conjunction with HMC264 or HMC265 mixers to realize a millimeterwave system receiver.

Applications

Millimeterwave Point-to-Point Radios
LMDS
VSAT
SATCOM

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC263 Die Datasheet 10/20/2015

Application Note 5

Thermal Management for Surface Mount Components General Application Note 11/11/2015

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-2622: Selecting an Analog Devices RF Low Noise Amplifier 09/04/2025

AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers 05/13/2020

AN-1604: Thermal Management Calculations for RF Amplifiers in LFCSP and Flange Packages 08/01/2019

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC263	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC263-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

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Sys-Parameter Models for Keysight Genesys

Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.

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S-Parameter 1

HMC263 Die S-Parameters

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