HMC158

Obsolete

HMC158 / HMC158C8

Passive frequency doubler chip and surface mount technology (SMT), 1.3 GHz to 4.0 GHz input

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Overview

  • Conversion loss: 15 dB
  • FO, 3FO, 4FO isolation: 40 dB
  • Input drive level: 10 dBm to 20 dBm
  • Die size (HMC158): 1.0 mm × 1.15 mm × 0.1 mm

The HMC158 devices are miniature frequency doublers that are available in a monolithic microwave integrated circuit (MMIC) die (HMC158) and a nonhermetic, ceramic surface mount package (HMC158C8). Suppression of undesired fundamental and higher order harmonics is 40 dB typical with respect to input signal level. The doublers use the same diode/balun technology used in Hittite MMIC mixers, feature small size, and require no dc bias.

Applications

  • Wireless local loop 
  • Local multipoint distribution systems (LMDS)
  • Very small aperture terminal (VSAT)
  • Point-to-point radios 
  • Unlicensed National Information Infrastructure (U-NII) and high performance radio LAN (HiperLAN)
  • Test equipment


Suggested Replacement Parts

HMC1096 RECOMMENDED FOR NEW DESIGNS

GaAs pHEMT MMIC x2 Active Frequency Multiplier, 3.8-5.6 GHz Output

HMC158
HMC158 / HMC158C8

Passive frequency doubler chip and surface mount technology (SMT), 1.3 GHz to 4.0 GHz input

HMC158_fbl HMC158C8_fbl
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Documentation

Data Sheet 1

Obsolete Data Sheet 1

Data Sheet

This is the most up-to-date revision of the Data Sheet.

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Software Resources

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Hardware Ecosystem

Parts Product Life Cycle Description
HMC1096 RECOMMENDED FOR NEW DESIGNS GaAs pHEMT MMIC x2 Active Frequency Multiplier, 3.8-5.6 GHz Output
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Tools & Simulations

S-Parameter 1


Evaluation Kits

EVAL-HMC158C8
HMC158C8 Evaluation Board.

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